Description
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES (piezo-electric, electrostrictive or magnetostrictive elements per se H01L 41/00)
B81B
Technology
Sub-Class
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- 58 377 US PATENTS IN FORCE
- 604 US APPLICATIONS PENDING
- 443 Total Patent Owners
- 2693 TOTAL INVENTORS
Subclasses
| Subclass | Title |
|---|---|
| 1/00 | Devices without movable or flexible elements, e.g. micro-capillary devices |
| 3/00 | Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (B81B 5/00 takes precedence) |
| 5/00 | Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements |
| 7/00 | Micro-structural systems |
| 7/02 | Micro-structural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. micro-electro-mechanical systems (MEMS) (B81B 7/04 takes precedence) |
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 9,120,067 | Micro mixer and microfluidic chip | Dec 13, 10 | Sep 01, 15 | KONICA MINOLTA, INC. |
| 9,120,298 | Method of continuously manufacturing microfluidic chips with BoPET film for a microfluidic device and microfluidic chips with BoPET film | Sep 16, 13 | Sep 01, 15 | FLUXERGY, LLC |
| 9,120,667 | Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures | Jun 20, 11 | Sep 01, 15 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 9,120,668 | Microphone package and mounting structure thereof | May 02, 14 | Sep 01, 15 | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 9,121,824 | Fluidic and electrical interface for microfluidic chips | Nov 14, 12 | Sep 01, 15 | METTLER-TOLEDO THORNTON, INC., |
| 9,121,825 | Methods and apparatuses for MEMs based recovery of sequence verified DNA | Dec 21, 12 | Sep 01, 15 | CAMBRIAN GENOMICS, INC. |
| 9,122,047 | Preventing glass particle injection during the oil fill process | Dec 31, 12 | Sep 01, 15 | PIXTRONIX, INC. |
| 9,125,321 | Package | Nov 09, 10 | Sep 01, 15 | MITSUBISHI ELECTRIC CORPORATION |
| 9,114,976 | Semiconductor arrangement with stress release configuration | Mar 07, 14 | Aug 25, 15 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 9,114,978 | Method for manufacturing a component having an electrical through-connection | Jun 19, 13 | Aug 25, 15 | ROBERT BOSCH GMBH |
| 9,116,344 | MEMS anchors | Nov 26, 13 | Aug 25, 15 | PIXTRONIX, INC. |
| 9,108,314 | Reconfigurable lithographic structures | Mar 12, 14 | Aug 18, 15 | THE JOHNS HOPKINS UNIVERSITY |
| 9,108,840 | MEMS microphone and method for packaging the same | Dec 30, 10 | Aug 18, 15 | GOERTEK, INC. |
| 9,110,017 | Apparatuses and methods for manipulating droplets | Nov 11, 14 | Aug 18, 15 | DUKE UNIVERSITY |
| 9,101,929 | Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system | Mar 17, 11 | Aug 11, 15 | ROBERT BOSCH GMBH |
| 9,101,934 | Liquid handling apparatus | Oct 18, 13 | Aug 11, 15 | ENPLAS CORPORATION |
| 9,102,512 | Sealed MEMS devices with multiple chamber pressures | Oct 04, 13 | Aug 11, 15 | ANALOG DEVICES, INC. |
| 9,102,513 | MEMS package structure | Jan 29, 14 | Aug 11, 15 | HIMAX DISPLAY, INC. |
| 9,102,519 | Semiconductor devices and methods of forming thereof | Mar 14, 13 | Aug 11, 15 | INFINEON TECHNOLOGIES AG |
| 9,103,845 | System and method for reducing offset variation in multifunction sensor devices | Mar 08, 13 | Aug 11, 15 | FREESCALE SEMICONDUCTOR, INC. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2015/0246,807 | MEMS Integrated Pressure Sensor Devices and Methods of Forming Same | May 15, 15 | Sep 03, 15 | Not available |
| 2015/0246,809 | DEVICES WITH THINNED WAFER | Mar 03, 14 | Sep 03, 15 | INFINEON TECHNOLOGIES AG |
| 2015/0238,079 | Systems and Methods for Miniaturizing Eyetracking Systems | Feb 28, 15 | Aug 27, 15 | LC TECHNOLOGIES, INC. |
| 2015/0239,731 | MICROELECTROMECHANICAL STRUCTURE WITH MOTION LIMITER | Feb 25, 15 | Aug 27, 15 | MURATA MANUFACTURING CO., LTD. |
| 2015/0239,732 | SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF | Feb 26, 14 | Aug 27, 15 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 2015/0239,733 | SEMICONDUCTOR DIE WITH HIGH PRESSURE CAVITY | Feb 24, 14 | Aug 27, 15 | FREESCALE SEMICONDUCTOR, INC. |
| 2015/0239,734 | ELECTRONIC DEVICE | Aug 01, 12 | Aug 27, 15 | PIONEER MICRO TECHNOLOGY CORPORATION, |
| 2015/0241,215 | MICRO ELECTRO MECHANICAL SYSTEMS SENSOR | Jan 21, 15 | Aug 27, 15 | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 2015/0241,216 | MICROELECTROMECHANICAL DEVICE WITH MOTION LIMITERS | Feb 25, 15 | Aug 27, 15 | MURATA MANUFACTURING CO., LTD. |
| 2015/0241,465 | PIEZORESISTIVE MEMS SENSOR | May 14, 15 | Aug 27, 15 | MURATA MANUFACTURING CO., LTD. |
| 2015/0241,466 | FUNCTIONAL ELEMENT, ELECTRONIC APPARATUS, AND MOVING OBJECT | Feb 23, 15 | Aug 27, 15 | SEIKO EPSON CORPORATION |
| 2015/0241,467 | MICROELECTROMECHANICAL STRUCTURE WITH FRAMES | Feb 25, 15 | Aug 27, 15 | MURATA MANUFACTURING CO., LTD. |
| 2015/0241,476 | METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED | May 09, 15 | Aug 27, 15 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 2015/0243,597 | SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING | Feb 25, 14 | Aug 27, 15 | INOTERA MEMORIES, INC. |
| 2015/0244,289 | VIBRATOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPLIANCE | Feb 18, 15 | Aug 27, 15 | SEIKO EPSON CORPORATION |
| 2015/0245,146 | MEMS MICROPHONE DEVICE | Feb 12, 15 | Aug 27, 15 | SENSOR TEK CO., LTD. |
| 2015/0231,530 | CENTRIFUGAL MICROFLUIDIC DEVICE | Jun 22, 12 | Aug 20, 15 | ROYAL MELBOURNE INSTITUTE OF TECHNOLOGY |
| 2015/0232,323 | Method for producing a micromechanical component, and micromechanical component | Feb 17, 15 | Aug 20, 15 | ROBERT BOSCH GMBH |
| 2015/0232,324 | NANO-ELECTROMECHANICAL SWITCH | Apr 27, 15 | Aug 20, 15 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 2015/0232,325 | MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF | Jan 09, 15 | Aug 20, 15 | CHIPMOS TECHNOLOGIES INC. |
Top Owners in This Class
Top Owners in This Subclass
Applications Filed in This Class - By Year
Applications Filed in This Subclass - By Year
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 32 Months (last 2 years Issuances)
- 32 Months (last 5 years Issuances)
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