SAMSUNG ELECTRO-MECHANICS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology MATTERS Rank in Class
 
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 602 2
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 573 8
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 424 108
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 358 3
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 263 46
 
 
H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY 136 25
 
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 126 126
 
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 124 11
 
 
H02K DYNAMO-ELECTRIC MACHINES 102 34
 
 
H04B TRANSMISSION 94 114
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Top Patents (by citation)

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0031,798 LENS MODULE AND CAMERA MODULE INCLUDING SAME Apr 28, 17 Feb 01, 18 [G02B]
2018/0033,533 INDUCTOR Apr 28, 17 Feb 01, 18 [H01F]
2018/0033,534 MAGNETIC MATERIAL AND DEVICE FOR TRANSMITTING DATA USING THE SAME May 16, 17 Feb 01, 18 [H01F, H04B]
2018/0033,535 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Apr 14, 17 Feb 01, 18 [H01F]
2018/0033,538 INDUCTOR Mar 13, 17 Feb 01, 18 [H01F]
2018/0033,539 INDUCTOR HAVING VIA CONNECTION LAYER Mar 13, 17 Feb 01, 18 [H01F]
2018/0033,540 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Mar 29, 17 Feb 01, 18 [H01F]
2018/0033,541 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Apr 12, 17 Feb 01, 18 [H01F]
2018/0033,546 ELECTRONIC COMPONENT Feb 28, 17 Feb 01, 18 [H03H, H01G, H01F]
2018/0033,550 COIL COMPONENT AND METHOD FOR MANUFACTURING SAME Jul 20, 17 Feb 01, 18 [H01F]
2018/0033,552 MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN Oct 09, 17 Feb 01, 18 [H01G, H05K]
2018/0033,555 DIELECTRIC CERAMIC COMPOSITION, MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR Apr 04, 17 Feb 01, 18 [C04B, H01G]
2018/0033,559 THIN FILM CAPACITOR Feb 14, 17 Feb 01, 18 [H01G]
2018/0033,560 THIN-FILM CAPACITOR HAVING ASYMMETRIC SHAPED VIAS Apr 12, 17 Feb 01, 18 [H01G]
2018/0035,031 CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE INCLUDING THE SAME Jul 10, 17 Feb 01, 18 [H04N]
2018/0035,545 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME May 10, 17 Feb 01, 18 [H01G, H05K]
2018/0027,656 CAPACITOR AND BOARD HAVING THE SAME Mar 03, 17 Jan 25, 18 [H01G, H05K]
2018/0027,658 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Apr 20, 17 Jan 25, 18 [H01G, H05K]
2018/0019,050 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Apr 04, 17 Jan 18, 18 [H01F]
2018/0019,051 COIL COMPONENT AND METHOD OF MANUFACTURING SAME Apr 14, 17 Jan 18, 18 [H01F]
2018/0019,063 FILM CAPACITOR Mar 23, 17 Jan 18, 18 [H01G]
2018/0019,064 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME May 15, 17 Jan 18, 18 [H01G, H01L]
2018/0019,211 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Jun 27, 17 Jan 18, 18 [H01L]
2018/0019,723 BULK ACOUSTIC WAVE FILTER DEVICE Jun 15, 17 Jan 18, 18 [H03H, H01L]
2018/0019,725 BULK ACOUSTIC WAVE FILTER DEVICE AND METHOD FOR MANUFACTURING THE SAME Jun 15, 17 Jan 18, 18 [H03H, H01L]
2018/0019,726 BULK ACOUSTIC WAVE RESONATOR DEVICE Jun 30, 17 Jan 18, 18 [H03H]
2018/0020,545 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Mar 23, 17 Jan 18, 18 [H01G, H05K]
2018/0012,696 COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME Mar 28, 17 Jan 11, 18 [H01F]
2018/0012,697 COIL COMPONENT Apr 21, 17 Jan 11, 18 [H01F]
2018/0012,700 COIL COMPONENT Jun 12, 17 Jan 11, 18 [H03H, H01F]
2018/0013,397 BULK ACOUSTIC WAVE FILTER DEVICE AND METHOD OF MANUFACTURING THE SAME Jun 13, 17 Jan 11, 18 [H03H]
2018/0013,401 ACOUSTIC RESONATOR AND METHOD Dec 27, 16 Jan 11, 18 [H03H]
2018/0013,407 RADIO FREQUENCY SWITCH CIRCUIT AND APPARATUS HAVING BUILT-IN COUPLER Dec 27, 16 Jan 11, 18 [H03H, H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9879998 Angular velocity sensor Jan 29, 16 Jan 30, 18 [G01C]
9881726 Method for manufacturing magnetic substrate and common mode filter Feb 05, 14 Jan 30, 18 [H01F, H05K]
9881736 Multilayer ceramic component Nov 13, 15 Jan 30, 18 [H01G, H05K]
9881873 Fan-out semiconductor package Jan 31, 17 Jan 30, 18 [H01L]
9882268 Radiator frame having antenna pattern embedded therein and method of manufacturing the same Aug 19, 15 Jan 30, 18 [H01Q, B29L, B29C]
9882396 Non-contact type power transmission apparatus and method thereof and location-based service system using the same Jul 06, 15 Jan 30, 18 [H04W, H02J]
9882412 Non-contact type power receiver and non-contact type battery May 28, 15 Jan 30, 18 [H04L, H02J]
9874716 Lens driving device Feb 18, 16 Jan 23, 18 [G02B]
9875837 Coil electronic component Apr 01, 16 Jan 23, 18 [H01F]
9875839 Magnetic composition and inductor including the same Jan 19, 16 Jan 23, 18 [H01F]
9875840 Chip coil component Nov 30, 16 Jan 23, 18 [H01F]
9875847 Multilayer ceramic electronic component and method of manufacturing the same Jan 21, 16 Jan 23, 18 [C04B, H01G, C03C]
9875849 Multilayer ceramic electronic component and manufacturing method thereof Jan 07, 16 Jan 23, 18 [H01G]
9875850 Multilayer ceramic electronic component and board having the same mounted thereon Dec 22, 16 Jan 23, 18 [H01G]
9875970 Fan-out semiconductor package Jan 24, 17 Jan 23, 18 [H01L]
9876363 Non-contact type power transmitting apparatus, non-contact type power transmitting-receiving apparatus, contact/non-contact type power transmitting apparatus, and contact/non-contact type power transmitting-receiving apparatus Mar 03, 15 Jan 23, 18 [H01F, H02J]
9876445 Piezoelectric energy harvester and wireless switch including the same Sep 01, 15 Jan 23, 18 [H02N, H01L]
9876472 Envelope tracking power amplifying apparatus and method Sep 20, 16 Jan 23, 18 [H03F]
9876496 Radio frequency switch circuit Nov 30, 15 Jan 23, 18 [H03K]
9877381 Composite electronic component and board on which composite electronic component is mounted Jun 28, 16 Jan 23, 18 [H01G, H05K]
9877392 PCB capacitor variable device and method Nov 04, 14 Jan 23, 18 [H01G, H05K]
9871600 Wireless switch Jul 13, 15 Jan 16, 18 [H01H, H02N, H01L, H04B, H03K]
9865399 Electronic component having multilayer structure and method of manufacturing the same Oct 06, 15 Jan 09, 18 [H01G]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0101,307 SEMICONDUCTOR PACKAGE ABAN Jun 14, 16 Apr 13, 17 [G01D, B81B, H01L]
2017/0094,786 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME ABAN Feb 24, 16 Mar 30, 17 [H05K]
2017/0086,290 PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FABRICATING THE SAME ABAN Apr 14, 16 Mar 23, 17 [H05K]
2017/0062,115 COIL COMPONENT ASSEMBLY AND COIL COMPONENT ABAN Mar 15, 16 Mar 02, 17 [H01F]
2017/0032,886 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME ABAN Mar 21, 16 Feb 02, 17 [H01F]
2017/0033,039 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME ABAN Mar 18, 16 Feb 02, 17 [H01L]
2017/0026,008 PROTECTION CIRCUIT OF POWER AMPLIFICATION CIRCUIT AND POWER AMPLIFICATION CIRCUIT USING THE SAME ABAN Feb 24, 16 Jan 26, 17 [H03F]
2017/0018,513 SEMICONDUCTOR PACKAGE INCLUDING AN ANTENNA FORMED IN A GROOVE WITHIN A SEALING ELEMENT ABAN Sep 27, 16 Jan 19, 17 [H01L]
2017/0019,510 COVER FOR ELECTRONIC DEVICE, ANTENNA ASSEMBLY, ELECTRONIC DEVICE, AND METHOD FOR MANFUACTURING THE SAME ABAN Sep 30, 16 Jan 19, 17 [H01Q, H04M, C25D]
2017/0019,989 CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME ABAN Feb 23, 16 Jan 19, 17 [H05K]
2017/0005,032 LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME ABAN Jan 08, 16 Jan 05, 17 [H01L]
2017/0006,707 ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME ABAN Mar 02, 16 Jan 05, 17 [H05K]
2016/0374,198 PRINTED CIRCUIT BOARD ABAN Jan 21, 16 Dec 22, 16 [H05K]
2016/0360,609 CIRCUIT SUBSTRATE AND ELECTRONIC EQUIPMENT INCLUDING THE SAME ABAN Mar 22, 16 Dec 08, 16 [H05K]
2016/0353,027 IMAGE CORRECTION CIRCUIT AND IMAGE CORRECTION METHOD ABAN Mar 21, 16 Dec 01, 16 [H04N, G06T]
2016/0338,211 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME ABAN Mar 28, 16 Nov 17, 16 [H05K]
2016/0322,999 ELECTRONIC DEVICE INCLUDING ANTENNA ABAN Apr 05, 16 Nov 03, 16 [H01Q, H04B]
2016/0313,201 PRESSURE SENSOR PACKAGE ABAN Jan 07, 16 Oct 27, 16 [G01L]
2016/0300,773 PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME ABAN Mar 04, 16 Oct 13, 16 [H01L]
2016/0300,996 BULK ACOUSTIC WAVE RESONATOR AND FILTER INCLUDING THE SAME ABAN Jan 21, 16 Oct 13, 16 [H03H, H01L]

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