Electronic device
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United States of America Patent
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Oct 20, 2015
Grant Date -
Aug 27, 2015
app pub date -
Aug 1, 2012
filing date -
Aug 1, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.
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