Method of forming surface protrusions on an article and the article with the protrusions attached
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United States of America Patent
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Nov 20, 2018
Grant Date -
Aug 27, 2015
app pub date -
May 9, 2015
filing date -
Feb 22, 2014
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Abstract
A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.
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