Devices with thinned wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9428381
APP PUB NO 20150246809A1
SERIAL NO

14194912

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Abstract

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Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 μm or below.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGAM CAMPEON 1-12 NEUBIBERG 85579

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brockmeier, Andre Villach, AT 39 429
Griessler, Christian Villach, AT 1 2
Maier, Katharina Villach, AT 3 2
Schreiber, Kai-Alexander Villach, AT 6 23
Solazzi, Francesco Villach, AT 4 3
Zorn, Peter Villach, AT 10 26

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