Description
Class B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
Subclass 7/00: Micro-structural systems
B81B 7/00
Sub-Class
Stats
- 2,298 US PATENTS IN FORCE
- 508 US APPLICATIONS PENDING
- 265 Total Patent Owners
- 4,180 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12266610 | Semiconductor package device and method for manufacturing the same | Sep 12, 22 | Apr 01, 25 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
| 12259546 | Micromirror arrays | Aug 05, 20 | Mar 25, 25 | ASML NETHERLANDS B.V. |
| 12258264 | Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate | Jun 03, 22 | Mar 25, 25 | IBM Corporation |
| 12258266 | Method and system for fabricating a MEMS device | Jul 29, 22 | Mar 25, 25 | Invensense, Inc. |
| 12251729 | Piezoelectric micromachined ultrasonic transducer comprising a lobed membrane element and methods of manufacturing thereof | Oct 08, 21 | Mar 18, 25 | SMI STMicroelectronics S.r.l |
| 12253426 | Parasitic insensitive sampling in sensors | Jan 03, 24 | Mar 18, 25 | Murata Manufacturing Co., Ltd. |
| 12240750 | Tiles having multiple cooling cells for MEMS-based cooling | Sep 14, 21 | Mar 04, 25 | Frore Systems Inc. |
| 12240751 | Sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method | Jun 05, 20 | Mar 04, 25 | TDK Corporation |
| 12240239 | Microfluidic passage with protective layer | Jun 12, 20 | Mar 04, 25 | Hewlett-Packard Development Company, L.P. |
| 12234141 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Jul 25, 23 | Feb 25, 25 | Taiwan Semiconductor Manufacturing Company Limited |
| 12235439 | MEMS mirror system with slow light beam deflection using fast resonant oscillations about at least two resonant axes | Aug 26, 21 | Feb 25, 25 | Infineon Technologies AG |
| 12227410 | Semiconductor device and method for forming the same | Jan 05, 24 | Feb 18, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12221339 | Semiconductor device and method of manufacturing semiconductor device | Feb 08, 24 | Feb 11, 25 | Amkor Technology Singapore Holding Pte Ltd. |
| 12222246 | Wearable device | Jun 07, 23 | Feb 11, 25 | PixArt Imaging Inc. |
| 12215021 | Capacitive sensing circuit and capacitive sensing method | Aug 01, 23 | Feb 04, 25 | AAC Technologies Pte. Ltd. |
| 12215024 | Adaptive MEMS device, codec for use with the MEMS device and method for providing diagnostic data, at run-time, on the current condition of a MEMS device | Oct 05, 21 | Feb 04, 25 | Infineon Technologies AG |
| 12208416 | CMUT-on-CMOS ultrasonic transducer by bonding active wafers and manufacturing method thereof | Nov 24, 22 | Jan 28, 25 | Zhejiang Xiansheng Technology Co., Ltd. |
| 12209009 | MEMS device built using the BEOL metal layers of a solid state semiconductor process | Sep 05, 23 | Jan 28, 25 | Nanusens SL |
| 12209012 | Wafer level package for device | Jan 25, 21 | Jan 28, 25 | Teknologian tutkimuskeskus VTT Oy |
| 12209015 | MEMS packages and methods of manufacture thereof | May 12, 23 | Jan 28, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,715 | MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES | Jan 24, 23 | Apr 10, 25 | Analog Devices Inc. |
| 2025/0109,010 | PRESSURE VALVE FOR MICROELECTROMECHANICAL SYSTEM DIE | Oct 03, 23 | Apr 03, 25 | Not available |
| 2025/0109,011 | INTEGRATED SENSOR DEVICE | Sep 18, 24 | Apr 03, 25 | Not available |
| 2025/0109,015 | MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A METHOD FOR MANUFACTURING IT | Sep 24, 24 | Apr 03, 25 | Not available |
| 2025/0109,016 | PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR COMPONENT AND CORRESPONDING MICROMECHANICAL SENSOR COMPONENT | Sep 26, 24 | Apr 03, 25 | Not available |
| 2025/0109,972 | SENSOR PACKAGE AND SENSING MODULE THEREOF | Sep 30, 24 | Apr 03, 25 | Not available |
| 2025/0100,872 | AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE | Sep 19, 24 | Mar 27, 25 | MEMSensing Microsystems (Suzhou, China) Co., Ltd. |
| 2025/0091,859 | SENSOR PACKAGE WITH HOLLOW STRUCTURE AND METHOD FOR ASSEMBLING SENSOR PACKAGE | Sep 16, 24 | Mar 20, 25 | Not available |
| 2025/0075,825 | VIRTUAL VALVE IN A MEMS-BASED COOLING SYSTEM | Nov 20, 24 | Mar 06, 25 | Not available |
| 2025/0076,135 | SENSING ELEMENT AND RELATED METHODS | Nov 20, 24 | Mar 06, 25 | Not available |
| 2025/0074,765 | HIGH RELIABILITY SENSOR | Aug 28, 23 | Mar 06, 25 | Not available |
| 2025/0074,766 | METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE | Nov 15, 24 | Mar 06, 25 | Not available |
| 2025/0067,542 | ELECTRONIC TARGET WITH MEMS SENSOR | Aug 24, 23 | Feb 27, 25 | Not available |
| 2025/0066,186 | ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR | Jan 30, 23 | Feb 27, 25 | Not available |
| 2025/0066,187 | TEMPERATURE STABILIZATION OF MICRO ELECTROMECHANICAL SYSTEM SENSORS FOR ANTENNA MONITORING DEVICES | Aug 25, 23 | Feb 27, 25 | Viavi Solutions Inc. |
| 2025/0059,023 | FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE | Aug 17, 23 | Feb 20, 25 | Not available |
| 2025/0059,024 | MICRO-ELECTROMECHANICAL SYSTEM (MEMS) STRUCTURE AND MEMS MICROPHONE COMPRISING SAME | Oct 13, 22 | Feb 20, 25 | Memsensing Microsystems (Suzhou, China) Co., Ltd. |
| 2025/0059,025 | METHOD FOR DETECTING CONTAMINATION OF A MEMS SENSOR | Jul 31, 24 | Feb 20, 25 | Not available |
| 2025/0051,155 | ACOUSTIC MODULE WITH A CENTERED SOUND PORT | Aug 07, 24 | Feb 13, 25 | Not available |
| 2025/0042,724 | CAPACITIVE SENSING CIRCUIT AND CAPACITIVE SENSING METHOD | Aug 01, 23 | Feb 06, 25 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 22 Months (last 2 years Issuances)
- 22 Months (last 5 years Issuances)