Method for manufacturing a component having an electrical through-connection
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United States of America Patent
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Aug 25, 2015
Grant Date -
Dec 26, 2013
app pub date -
Jun 19, 2013
filing date -
Jun 21, 2012
priority date (Note) -
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Abstract
A method for manufacturing a component having an electrical through-connection includes: providing a semiconductor substrate having a front side and a back side opposite from the front side; producing, on the front side of the semiconductor substrate, an insulating trench which annularly surrounds a contact area; introducing an insulating material into the insulating trench; producing a contact hole on the front side of the semiconductor substrate by removing the semiconductor material surrounded by the insulating trench in the contact area; and depositing a metallic material in the contact hole.
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