Microphone package and mounting structure thereof
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United States of America Patent
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Sep 1, 2015
Grant Date -
May 21, 2015
app pub date -
May 2, 2014
filing date -
Nov 21, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.
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