MEMS package structure
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United States of America Patent
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Aug 11, 2015
Grant Date -
Jul 30, 2015
app pub date -
Jan 29, 2014
filing date -
Jan 29, 2014
priority date (Note) -
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Abstract
A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
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