Importance

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Abstract

An MEMS package and the manufacturing method thereof are disclosed. The MEMS package includes a package substrate, a block ring, an MEMS chip and an encapsulating material. The package substrate has an inner surface, a corresponding outer surface and a signal opening that penetrates the inner surface and outer surface. The package substrate further has at least one inner contact pad and at least one outer contact pad wherein the outer contact pad is disposed on the outer surface. The inner contact pad is electrically coupled to the outer contact pad. The block ring is disposed on the inner surface and surrounds the signal opening. The MEMS chip has an active surface, at least one sensor device and at least one chip contact pad, wherein the sensor device and the chip contact pad are disposed on the active surface. The active surface is attached to the block ring so that the sensor device is surrounded by the block ring. The chip contact pad is electrically coupled to the inner contact pad. The encapsulating material covers the MEMS chip, the outer side of the block ring and the inner contact pad.

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First Claim