SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING
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United States of America Patent
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Issued Date -
Aug 27, 2015
app pub date -
Feb 25, 2014
filing date -
Feb 25, 2014
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Abstract
A semiconductor device includes a substrate having a front side and a rear side, a plurality of dielectric layers on the front side, a plurality of interconnection circuit structures in the dielectric layers, and at least one backside passivation layer on the rear side. The backside passivation layer and the top passivation layer are made of the same material and have substantially the same thickness.
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