Class B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
Subclass 7/02: Micro-structural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. micro-electro-mechanical systems (MEMS) (B81B 7/04 takes precedence)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12258266 | Method and system for fabricating a MEMS device | Jul 29, 22 | Mar 25, 25 | Invensense, Inc. |
| 12251936 | MEMS device, liquid ejecting head, and liquid ejecting apparatus | Jan 18, 23 | Mar 18, 25 | Seiko Epson Corporation |
| 12247846 | Temperature dependent calibration of movement detection devices | Jan 30, 23 | Mar 11, 25 | Magic Leap, Inc. |
| 12225824 | Process for manufacturing a thin-film piezoelectric microelectromechanical structure having improved electrical characteristics | Sep 27, 21 | Feb 11, 25 | STMicroelectronics S.r.l. |
| 12215022 | Microelectromechanical microphone with reduced overall size | Mar 19, 21 | Feb 04, 25 | Commissariat A L' Energie Atomique Et Aux Energies Alternatives |
| 12218395 | Phase shifter in which at least some of first sub-electrodes are short-circuited together and connected to a same connection portion | Sep 30, 21 | Feb 04, 25 | BOE Technology Group Co. Ltd. |
| 12219312 | Apparatus and method for MEMS microphone performance via back volume | Nov 22, 23 | Feb 04, 25 | Harman International Industries, Incorporated |
| 12203774 | Trim circuit and method of oscillator drive circuit phase calibration | Mar 08, 22 | Jan 21, 25 | NXP USA, Inc. |
| 12194464 | Integrated microfluidic system and method of fabrication | Apr 04, 22 | Jan 14, 25 | Corporation for National Research Initiatives |
| 12195329 | Micro-electromechanical transducer with reduced size | Nov 24, 21 | Jan 14, 25 | Sonion Nederland B.V. |
| 12187597 | MEMS microphone | Jun 07, 22 | Jan 07, 25 | AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD |
| 12188925 | Multi-stage, multiplexed target isolation and processing from heterogeneous populations | Jan 29, 21 | Jan 07, 25 | THE BROAD INSTITUTE, INC.; The General Hospital Corporation; Massachusetts Institute of Technology; |
| 12180068 | Self-folding 3D film assemblies | Dec 24, 19 | Dec 31, 24 | 3M Innovative Properties Company |
| 12180069 | Method and system for fabricating a MEMS device | Jul 29, 22 | Dec 31, 24 | Invensense, Inc. |
| 12185065 | Method for suppressing vibration coupled signals in a microphone for flight recorders | Aug 29, 22 | Dec 31, 24 | L3HARRIS AVIATION PRODUCTS, INC. |
| 12172886 | Micro-electro-mechanical system (MEMS) vibration sensor and fabricating method thereof | May 18, 22 | Dec 24, 24 | UPBEAT TECHNOLOGY CO., LTD |
| 12168601 | Interconnection scheme for dielectric element sensor | Apr 07, 22 | Dec 17, 24 | Knowles Electronics, LLC |
| 12157664 | Apparatus and method for dissipating heat with microelectromechanical system | Jun 27, 23 | Dec 03, 24 | CISCO TECHNOLOGY, INC. |
| 12151933 | Comb-drive device used in micro electro mechanical system | Mar 16, 21 | Nov 26, 24 | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Mar 29, 22 | Nov 12, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0120,319 | THIN-FILM PIEZOELECTRIC MICROELECTROMECHANICAL STRUCTURE HAVING IMPROVED ELECTRICAL CHARACTERISTICS AND CORRESPONDING MANUFACTURING PROCESS | Dec 19, 24 | Apr 10, 25 | STMicroelectronics S.r.l |
| 2025/0109,967 | TRIM CIRCUIT AND METHOD OF OSCILLATOR DRIVE CIRCUIT PHASE CALIBRATION | Dec 12, 24 | Apr 03, 25 | Not available |
| 2025/0083,950 | SENSOR | Jul 01, 24 | Mar 13, 25 | KABUSHIKI KAISHA TOSHIBA |
| 2025/0074,766 | METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE | Nov 15, 24 | Mar 06, 25 | Not available |
| 2025/0058,353 | SEMICONDUCTOR ULTRASONIC TRANSDUCER DEVICE AND METHODS OF FORMATION | Aug 16, 23 | Feb 20, 25 | Not available |
| 2025/0059,026 | SELF-FOLDING 3D FILM ASSEMBLIES | Nov 08, 24 | Feb 20, 25 | Not available |
| 2025/0047,511 | ACTIVE TRANSISTOR PHYSICAL UNCLONABLE FUNCTION (PUF) CIRCUIT WITH MEMS UNIQUENESS | May 10, 24 | Feb 06, 25 | Honeywell International, Inc. |
| 2025/0026,633 | Dual-Layer Micro-ribbon MEMS Light Modulator | Apr 15, 24 | Jan 23, 25 | Silicon Light Machines Corporation |
| 2025/0002,331 | COMMON MODE REJECTION STRUCTURES FOR MEMS DEVICES | Jun 30, 23 | Jan 02, 25 | Not available |
| 2025/0002,332 | MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION OF PRESSURE AND INERTIAL DETECTION STRUCTURES AND CORRESPONDING MANUFACTURING PROCESS | Jun 17, 24 | Jan 02, 25 | STMicroelectronics International N.V. |
| 2025/0002,333 | WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME | Jun 28, 23 | Jan 02, 25 | STMicroelectronics International N.V. |
| 2025/0008,727 | MEMORY DEVICES AND ELECTRONIC SYSTEMS | Sep 16, 24 | Jan 02, 25 | Not available |
| 2024/0426,689 | Capacitive MEMS Sensing Diagnostic Mode | Jun 22, 23 | Dec 26, 24 | Not available |
| 2024/0425,363 | COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE | Jun 03, 24 | Dec 26, 24 | Not available |
| 2024/0402,483 | AUTOSTEREOSCOPIC CAMPFIRE DISPLAY | May 30, 23 | Dec 05, 24 | Not available |
| 2024/0405,454 | ELECTRICAL CONTACTS USING AN ARRAY OF MICROMACHINED FLEXURES | May 17, 24 | Dec 05, 24 | Not available |
| 2024/0383,743 | MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME | May 16, 23 | Nov 21, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0369,506 | HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM | Jul 17, 24 | Nov 07, 24 | KABUSHIKI KAISHA TOSHIBA |
| 2024/0359,973 | MEMS Switch, Preparation Method thereof, and Electronic Apparatus | Apr 27, 22 | Oct 31, 24 | Not available |
| 2024/0327,204 | DIRECTIONAL MEMS MICROPHONE | Apr 26, 23 | Oct 03, 24 | Merry Electronics (Shenzhen) Co., Ltd. |
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