H05K

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PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)

Subclasses

Not Available
Subclass Title
1/00 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
1/02 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details
1/03 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
1/05 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate Insulated metal substrate
1/09 Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the metallic pattern

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Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
9,120,272 Smooth composite structure Dec 02, 10 Sep 01, 15 APPLE INC., APPLE INC.
9,120,287 Techniques for bonding substrates using an intermediate layer Jul 31, 14 Sep 01, 15 MEDTRONIC, INC., MEDTRONIC INC.
9,120,408 Vehicle display system Sep 25, 12 Sep 01, 15 JET OPTOELECTRONICS CO., LTD., JET OPTOELECTRONICS CO., LTD.
9,120,631 Board working system, board conveying apparatus, and board working apparatus Nov 14, 13 Sep 01, 15 YAMAHA HATSUDOKI KABUSHIKI KAISHA, YAMAHA HATSUDOKI KABUSHIKI KAISHA
9,120,944 Copper particulate dispersion, conductive film forming method and circuit board Jan 04, 12 Sep 01, 15 ISHIHARA CHEMICAL CO., LTD, ISHIHARA CHEMICAL CO. LTD.; APPLIED NANOTECH HOLDINGS INC.;
9,120,954 Method, apparatus, and kit for protecting an electronic device Mar 06, 13 Sep 01, 15 NLU PRODUCTS, L.L.C., D.B.A. BODYGUARDZ, NLU PRODUCTS, L.L.C.
9,121,422 System board fastener May 31, 12 Sep 01, 15 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., HEWLETT-PACKARD COMPANY
9,121,497 Attachment of a control unit for a transmission control module to a carrier board Oct 31, 12 Sep 01, 15 ROBERT BOSCH GMBH, ROBERT BOSCH GMBH
9,121,579 Method for manufacturing integrally formed multi-layer light-emitting device Apr 27, 12 Sep 01, 15 GEM WELTRONICS TWN CORPORATION, GEM WELTRONICS TWN CORPORATION
9,121,626 Ventilation member Mar 26, 14 Sep 01, 15 NITTO DENKO CORPORATION, NITTO DENKO CORPORATION
9,121,645 Variable thickness heat pipe Feb 11, 13 Sep 01, 15 GOOGLE INC., GOOGLE INC.
9,121,646 Heat-dissipation unit coated with oxidation-resistant nano thin film and method of depositing the oxidation-resistant nano thin film thereof Aug 20, 13 Sep 01, 15 ASIA VITAL COMPONENTS CO., LTD., ASIA VITAL COMPONENTS, CO. LTD.
9,121,738 Measuring device of air flow rate for air conditioning system Mar 07, 13 Sep 01, 15 HITACHI, LTD., HITACHI, LTD.
9,121,867 Sensor and transporting device including the same May 28, 13 Sep 01, 15 HON HAI PRECISION INDUSTRY CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD
9,121,990 Planar light source apparatus and display apparatus using the same May 22, 12 Sep 01, 15 MITSUBISHI ELECTRIC CORPORATION, MITSUBISHI ELECTRIC CORPORATION
9,122,026 Optical waveguide, opto-electric hybrid board, and optical module Aug 28, 09 Sep 01, 15 HITACHI CHEMICAL COMPANY, LTD., HITACHI CHEMICAL COMPANY, LTD.
9,122,440 User feedback to indicate transitions between open and closed states Jan 09, 12 Sep 01, 15 Z124, Z124
9,122,441 Opening applications in unified desktop Mar 02, 12 Sep 01, 15 Z124, Z124
9,122,450 Portable electronic apparatus and casing therefor Mar 21, 14 Sep 01, 15 WISTRON CORPORATION, WISTRON CORPORATION
9,122,452 Electronic device May 24, 12 Sep 01, 15 FUJITSU LIMITED, FUJITSU LIMITED

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2015/0245,712 METHOD AND DEVICE FOR WALL MOUNTING FLAT PANEL MONITOR AND STORING ASSOCIATED AUDIO/VIDEO COMPONENTS May 15, 15 Sep 03, 15 INNOVATIVE AMERICANS LLC,
2015/0246,614 INDUCTIVE POWER COUPLING SYSTEMS FOR ROADWAYS Dec 21, 12 Sep 03, 15 ,
2015/0246,619 POWER CONVERTER AND MOTOR VEHICLE Feb 27, 15 Sep 03, 15 KABUSHIKI KAISHA YASKAWA DENKI,
2015/0246,647 SHIELD CONDUCTIVE PATH Feb 10, 15 Sep 03, 15 SUMITOMO WIRING SYSTEMS, LTD.,
2015/0247,055 CURABLE COMPOSITION FOR INKJET, AND METHOD FOR PRODUCING ELECTRONIC PART Sep 19, 13 Sep 03, 15 SEKISUI CHEMICAL CO., LTD.,
2015/0247,289 LAMINATE AND COMPOSITE Sep 02, 13 Sep 03, 15 SUMITOMO BAKELITE CO., LTD.,
2015/0247,382 DEGRADABLE DEVICES FOR USE IN SUBTERRANEAN WELLS Oct 22, 13 Sep 03, 15 HALLIBURTON ENERGY SERVICES, INC.,
2015/0247,544 DAMPER WITH INTEGRATED ELECTRONICS Jun 13, 14 Sep 03, 15 TENNECO AUTOMOTIVE OPERATING COMPANY INC.,
2015/0247,686 COOLING ASSEMBLY Oct 23, 13 Sep 03, 15 ALCATEL LUCENT,
2015/0248,142 EXPOSED GLASS ARTICLE WITH ENHANCED STIFFNESS FOR PORTABLE ELECTRONIC DEVICE HOUSING Feb 28, 14 Sep 03, 15 APPLE INC.,
2015/0248,946 ELECTRICALLY CONDUCTIVE COMPOSITION May 13, 15 Sep 03, 15 ,
2015/0248,949 HYDROGEL NETWORK Oct 25, 13 Sep 03, 15 ISIS INNOVATION LIMITED,
2015/0248,958 COLD SPRAY OF STAINLESS STEEL Dec 16, 14 Sep 03, 15 APPLE INC.,
2015/0249,198 One Up, One Down Connection Structure For Piezoelectric Device In Tire Patch Nov 15, 12 Sep 03, 15 MICHELIN RECHERCHE ET TECHNIQUE S.A.,
2015/0249,284 STRUCTURAL BODY AND WIRELESS COMMUNICATION APPARATUS Jan 16, 14 Sep 03, 15 SHARP KABUSHIKI KAISHA,
2015/0249,297 LOW-PROFILE PLUG WITH CAM AND FLEXIBLE CIRCUIT BOARD Mar 03, 14 Sep 03, 15 APPLE INC.,
2015/0249,328 ADJUSTABLE WIREWAY ASSEMBLY, METHOD OF EMPLOYING, AND ENCLOSURE EMPLOYING THE SAME Feb 28, 14 Sep 03, 15 EATON CORPORATION,
2015/0249,478 MEDICAL DEVICE CASE Mar 03, 15 Sep 03, 15 ,
2015/0250,047 FLEXIBLE PRINTED CIRCUIT BOARD, PLANAR LIGHT SOURCE APPARATUS, DISPLAY APPARATUS, AND ELECTRONIC DEVICE Jan 22, 15 Sep 03, 15 OMRON CORPORATION,
2015/0250,048 GROUNDING STRUCTURE FOR CIRCUIT BOARD Oct 02, 13 Sep 03, 15 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.,

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Patents Issued To Date - By Filing Year

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