Techniques for bonding substrates using an intermediate layer
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jan 22, 2015
app pub date -
Jul 31, 2014
filing date -
Dec 23, 2010
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Abstract
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
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