Variable thickness heat pipe
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United States of America Patent
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Sep 1, 2015
Grant Date -
Jul 9, 2015
app pub date -
Feb 11, 2013
filing date -
Feb 11, 2013
priority date (Note) -
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Abstract
In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.
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