Class H05K : PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Subclass 1/03: Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Details Use of materials for the substrate
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12264249 | Curable composition for inkjet, cured product and flexible printed circuit board | Oct 20, 20 | Apr 01, 25 | Microcosm Technology Co., Ltd. |
| 12264421 | Machine-knittable conductive hybrid yarns | Jan 23, 24 | Apr 01, 25 | Propel, LLC |
| 12263580 | Systems, devices, and methods for robotic end effectors | Oct 01, 21 | Apr 01, 25 | Sanctuary Cognitive Systems Corporation |
| 12263795 | Trim element comprising a functional layer made of carbon material | Nov 19, 21 | Apr 01, 25 | Faurecia Interieur Industrie |
| 12267950 | Flexible printed wiring board and battery wiring module | Jul 09, 20 | Apr 01, 25 | Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.; Sumitomo Wiring Systems LTD; Autonetworks Technologies Ltd.; |
| 12267954 | Fluororesin composition, fluororesin sheet, laminate and substrate for circuits | Mar 08, 24 | Apr 01, 25 | DAIKIN INDUSTRIES, LTD. |
| 12267958 | Electronic component and manufacturing method thereof | Jul 07, 23 | Apr 01, 25 | Murata Manufacturing Co., Ltd. |
| 12258445 | Curable compositions | Nov 14, 23 | Mar 25, 25 | AGC Multi Material America, Inc. |
| 12262479 | Extension structure of flexible substrates with conductive wires thereon | Mar 16, 23 | Mar 25, 25 | UNEO INC. |
| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12251862 | Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission | Apr 11, 24 | Mar 18, 25 | Nanjing University; JIANGSU HHCK ADVANCED MATERIALS CO., LTD.; |
| 12256490 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Dec 10, 18 | Mar 18, 25 | Resonac Corporation |
| 12247124 | Resin sheet | Jan 15, 21 | Mar 11, 25 | Lintec Corporation |
| 12249547 | Bonded substrate and bonded substrate manufacturing method | May 25, 22 | Mar 11, 25 | NGK Insulators Ltd. |
| 12250767 | Dielectric substrate and method of forming the same | Sep 21, 23 | Mar 11, 25 | VERSIV COMPOSITES LIMITED |
| 12250776 | Substrate structure and cutting method thereof | May 15, 23 | Mar 11, 25 | Unimicron Technology Corp. |
| 12240102 | Systems, devices, and methods for robotic end effectors | Oct 01, 21 | Mar 04, 25 | Sanctuary Cognitive Systems Corporation |
| 12243813 | Connection structure and method of forming the same | Oct 10, 23 | Mar 04, 25 | Samsung Electronics Co. Ltd. |
| 12245364 | Wiring board and electronic device | Nov 22, 22 | Mar 04, 25 | Shinko Electric Industries Co. Ltd. |
| 12245365 | High-frequency electronic component and module | Feb 24, 23 | Mar 04, 25 | Murata Manufacturing Co Ltd. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0115,751 | THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME | Oct 03, 24 | Apr 10, 25 | Not available |
| 2025/0120,016 | WIRING BOARD | Dec 22, 22 | Apr 10, 25 | KYOCERA CORPORATION |
| 2025/0108,924 | MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER | Nov 29, 23 | Apr 03, 25 | B/E Aerospace, Inc. |
| 2025/0109,057 | GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC PRODUCT INCLUDING THE GLASS FIBER | Apr 26, 24 | Apr 03, 25 | Not available |
| 2025/0109,279 | COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | Dec 11, 24 | Apr 03, 25 | Not available |
| 2025/0110,529 | FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE | Dec 12, 24 | Apr 03, 25 | Not available |
| 2025/0112,144 | INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES | Sep 28, 23 | Apr 03, 25 | Intel Corp. |
| 2025/0112,588 | FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPLYING ELECTRIC ENERGY TO AN ORBITING SATELLITE | Dec 13, 23 | Apr 03, 25 | Not available |
| 2025/0109,530 | GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD | Jun 01, 23 | Apr 03, 25 | Not available |
| 2025/0113,434 | THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION | Sep 28, 23 | Apr 03, 25 | Not available |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0113,445 | SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL PROPERTIES OF A METAL MATERIAL UTILIZED IN A DEFORMABLE CIRCUIT | Oct 02, 23 | Apr 03, 25 | Not available |
| 2025/0101,182 | POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF | Jan 06, 23 | Mar 27, 25 | SOLVAY SPECIALTY POLYMERS USA, LLC |
| 2025/0101,217 | RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME | Oct 19, 23 | Mar 27, 25 | LG Chem Ltd. |
| 2025/0105,132 | POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0106,982 | NANOTWIN LINER FOR THROUGH GLASS VIAS | Sep 25, 23 | Mar 27, 25 | Not available |
| 2025/0106,983 | STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION | Sep 27, 23 | Mar 27, 25 | Not available |
| 2025/0106,997 | ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0098,065 | BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME | Dec 04, 24 | Mar 20, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0098,074 | MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD | Sep 19, 23 | Mar 20, 25 | Not available |
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