ISHIHARA CHEMICAL CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7149
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 646
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 668
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 488
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 447
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 299
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 264

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0283,916 Ta-Nb ALLOY POWDER AND ANODE ELEMENT FOR SOLID ELECTROLYTIC CAPACITORSep 11, 14Oct 05, 17[B22F, C22C, H01G]
2016/0104,580 TA POWDER, PRODUCTION METHOD THEREFOR, AND TA GRANULATED POWDERJun 13, 13Apr 14, 16[B22F, H01G]
2016/0007,455 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARDJan 31, 14Jan 07, 16[H01B, B22F, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905339 Conductive film forming method and sintering promoterFeb 28, 13Feb 27, 18[C23C, C09D, H01B, H05K]
9730333 Photo-curing process for metallic inksMay 14, 09Aug 08, 17[B05D, H05K]
9615455 Copper particulate dispersion, conductive film forming method and circuit boardJan 04, 12Apr 04, 17[H01L, C09D, H01B, H05K]
9131610 Buffer layer for sinteringNov 07, 13Sep 08, 15[H01L, B23K, B22F, H05K]
9120944 Copper particulate dispersion, conductive film forming method and circuit boardJan 04, 12Sep 01, 15[H01L, C09D, H01B, H05K]
8647979 Buffer layer to enhance photo and/or laser sinteringMar 26, 10Feb 11, 14[H01L]
8506849 Additives and modifiers for solvent- and water-based metallic conductive inksFeb 24, 09Aug 13, 13[H01B]
8404160 Metallic inkMar 31, 09Mar 26, 13[H01B]
7938948 Silver and silver alloy plating bathSep 03, 09May 10, 11[C23C, C25D]
7799112 Production method of pure metal/alloy super-micro powderNov 05, 03Sep 21, 10[B22F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0029,483 COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARDAbandonedJan 31, 14Jan 28, 16[H05K]
2015/0030,784 CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTERAbandonedFeb 28, 13Jan 29, 15[H01B, B22F]
2015/0021,071 CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPROVERAbandonedFeb 28, 13Jan 22, 15[H05K]
2014/0216,799 CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND CIRCUIT BOARDAbandonedAug 13, 12Aug 07, 14[C09D, H05K]
2011/0139,626 ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND COPPER ELECTROLYTE FOR MANUFACTURING ELECTROLYTIC COPPER COATINGAbandonedJun 12, 09Jun 16, 11[C25D]
2010/0000,762 METALLIC PASTES AND INKSAbandonedJul 01, 09Jan 07, 10[C09D, H01B, H01R]
2006/0113,006 Tin-containing plating bathAbandonedJan 22, 04Jun 01, 06[C23C]
2003/0150,743 Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bathAbandonedSep 20, 02Aug 14, 03[C25D, C09D]
4804410 Palladium-base electroless plating solutionExpiredOct 21, 87Feb 14, 89[C09D, B22F]
4673470 Tin, lead, or tin-lead alloy plating bathExpiredFeb 21, 86Jun 16, 87[C25D]
4555314 Tin-lead alloy plating bathExpiredSep 10, 84Nov 26, 85[C25D]

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