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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
APPLIED NANOTECH HOLDINGS INC	3006 LONGHORN BLVD SUITE 107 AUSTIN TX 78758-7631
ISHIHARA CHEMICAL CO LTD	KOBE CITY HYOGO HYOGO DISTRICT XILIU HARAMACHI 5 NO 26

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kawato, Yuichi	Hyogo, JP	8	39
Kudo, Tomio	Hyogo, JP	10	53
Maeda, Yusuke	Hyogo, JP	48	50

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 1, 2027

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 01, 2015	US,9120944,B2   US9120944B2	GRANTED PATENT AS SECOND PUBLICATION
August 07, 2014	US,20140216798,A1   US20140216798A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9120944

Copper particulate dispersion, conductive film forming method and circuit board

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