| 1/00 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) |
| 1/002 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of induction heating |
| 1/005 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of radiant energy |
| 1/008 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering within a furnace (B23K 1/012 takes precedence) |
| 1/012 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas |
| 1/015 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas Vapour-condensation soldering |
| 1/018 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Unsoldering; Removal of melted solder or other residues |
| 1/06 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) making use of vibrations, e.g. supersonic vibrations |
| 1/08 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of dipping in molten solder |
| 1/14 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C) |
| 1/16 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C) longitudinal seams, e.g. of shells |
| 1/18 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) specially adapted for soldering seams (making tubes involving operations other than soldering B21C) circumferential seams, e.g. of shells |
| 1/19 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) taking account of the properties of the materials to be soldered |
| 1/20 | Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating (preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C) |
| 3/00 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) |
| 3/02 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Soldering irons; Bits |
| 3/03 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Soldering irons; Bits electrically heated |
| 3/04 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B) |
| 3/047 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B) electric |
| 3/053 | Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B) electric using resistance wires |