| 2025/0118,881 | MULTILAYER RADIO FREQUENCY COMPONENT | Oct 06, 23 | Apr 10, 25 | Not available |
| 2025/0118,895 | ELECTRONIC DEVICE | Dec 17, 24 | Apr 10, 25 | Chimei Innolux Corporation |
| 2025/0118,912 | BUS CONNECTION CABLE REVERSE-WELDING STRUCTURE | Nov 30, 23 | Apr 10, 25 | Not available |
| 2025/0120,006 | PRINTED CIRCUIT BOARD | Jul 18, 24 | Apr 10, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0120,008 | PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION | Dec 22, 23 | Apr 10, 25 | PANJIT INTERNATIONAL INC. |
| 2025/0120,009 | SEMICONDUCTOR PACKAGE | Sep 05, 24 | Apr 10, 25 | Samsung Electronics Co., Ltd. |
| 2025/0120,010 | WIRING BOARD | Sep 30, 24 | Apr 10, 25 | Not available |
| 2025/0120,014 | CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD | May 31, 24 | Apr 10, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0120,016 | WIRING BOARD | Dec 22, 22 | Apr 10, 25 | KYOCERA CORPORATION |
| 2025/0120,017 | Contact Hole Assembly and Electronic Device | Oct 02, 24 | Apr 10, 25 | Not available |
| 2025/0112,144 | INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES | Sep 28, 23 | Apr 03, 25 | Intel Corp. |
| 2025/0113,428 | TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD | Sep 29, 23 | Apr 03, 25 | Not available |
| 2025/0113,432 | CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE | Dec 18, 23 | Apr 03, 25 | Not available |
| 2025/0113,433 | BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS | Dec 12, 24 | Apr 03, 25 | Amphenol Corporation |
| 2025/0113,434 | THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION | Sep 28, 23 | Apr 03, 25 | Not available |
| 2025/0113,438 | WIRING BOARD AND SEMICONDUCTOR DEVICE | Sep 13, 24 | Apr 03, 25 | Not available |
| 2025/0102,633 | OPTICAL PACKAGING STRUCTURE FOR LIDAR | Aug 08, 24 | Mar 27, 25 | Not available |
| 2025/0104,652 | Source Printed Circuit Board and Display Device | Sep 11, 24 | Mar 27, 25 | Not available |
| 2025/0104,902 | MANUFACTURING METHOD OF POWER MODULE | Dec 09, 24 | Mar 27, 25 | Not available |
| 2025/0105,132 | POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES | Sep 26, 23 | Mar 27, 25 | Not available |