| 2025/0112,083 | MULTI-MATERIAL CHUCK | Oct 03, 23 | Apr 03, 25 | Tokyo Electron Limited |
| 2025/0022,747 | PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTAL MATERIAL | Sep 30, 24 | Jan 16, 25 | Not available |
| 2025/0014,889 | PROCESSING METHOD OF WAFER | Jun 25, 24 | Jan 09, 25 | Not available |
| 2025/0014,949 | PROCESSING METHOD OF WAFER | Jul 02, 24 | Jan 09, 25 | Not available |
| 2024/0404,859 | SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE CORRECTION METHOD, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Aug 09, 24 | Dec 05, 24 | Nikon Corporation |
| 2024/0395,752 | BONDING STRUCTURE AND METHOD OF FORMING SAME | Jul 31, 24 | Nov 28, 24 | Not available |
| 2024/0395,873 | III-N SILICON SEMICONDUCTOR WAFER | Aug 05, 24 | Nov 28, 24 | AZUR SPACE SOLAR POWER GMBH |
| 2024/0387,176 | STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING APPARATUS | Aug 19, 22 | Nov 21, 24 | Not available |
| 2024/0387,177 | BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER | Jul 26, 24 | Nov 21, 24 | Nikon Corporation |
| 2024/0379,505 | Bond Films for Reduced Thermal Resistance and Methods Forming the Same | May 09, 23 | Nov 14, 24 | Not available |
| 2024/0371,641 | METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND COMPOUND SEMICONDUCTOR BONDED SUBSTRATE | Mar 17, 22 | Nov 07, 24 | Shin-Etsu Handotai Co Ltd. |
| 2024/0371,850 | TECHNIQUES FOR PROCESSING DEVICES | Dec 15, 23 | Nov 07, 24 | Not available |
| 2024/0347,339 | COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES | Apr 17, 23 | Oct 17, 24 | Not available |
| 2024/0322,002 | HETEROGENEOUS HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES AND METHODS OF MAKING AND USE THEREOF | Jan 22, 24 | Sep 26, 24 | Not available |
| 2024/0304,494 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS | Mar 06, 24 | Sep 12, 24 | Kioxia Corporation |
| 2024/0274,573 | METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION | Apr 01, 24 | Aug 15, 24 | Not available |
| 2024/0266,172 | SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDING INTERFACE, AND ASSOCIATED MANUFACTURING METHOD | Jun 08, 21 | Aug 08, 24 | Not available |
| 2024/0250,166 | TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Dec 08, 23 | Jul 25, 24 | Not available |
| 2024/0222,440 | TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS | Dec 28, 22 | Jul 04, 24 | Not available |
| 2024/0203,804 | ENGINEERED SEMICONDUCTOR SUBSTRATE | Nov 20, 23 | Jun 20, 24 | Not available |