H01L 21/108

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2020/0365,394 Transistor Structure With A Stress LayerMay 14, 20Nov 19, 20Not available
2020/0111,671 SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONSDec 05, 19Apr 09, 20Advanced Semiconductor Engineering, Inc.
2019/0206,683 SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONSMar 08, 19Jul 04, 19Advanced Semiconductor Engineering, Inc.
2019/0206,684 SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONSMar 08, 19Jul 04, 19Advanced Semiconductor Engineering, Inc.
2018/0047,571 SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONSJun 06, 17Feb 15, 18ADVANCED SEMICONDUCTOR ENGINEERING, INC.