| 2025/0102,887 | DEVICE WITH A RECESSED GATE ELECTRODE THAT HAS HIGH THICKNESS UNIFORMITY | Dec 09, 24 | Mar 27, 25 | Not available |
| 2024/0416,514 | CALIBRATION SYSTEM | Aug 29, 24 | Dec 19, 24 | Not available |
| 2024/0069,412 | IMAGE PICKUP DEVICE AND METHOD OF TRACKING SUBJECT THEREOF | Nov 08, 23 | Feb 29, 24 | Not available |
| 2024/0061,320 | DEVICE WITH A RECESSED GATE ELECTRODE THAT HAS HIGH THICKNESS UNIFORMITY | Nov 03, 23 | Feb 22, 24 | Not available |
| 2024/0047,604 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME | Oct 17, 23 | Feb 08, 24 | Not available |
| 2022/0181,513 | HYBRID GROWTH METHOD FOR III-NITRIDE TUNNEL JUNCTION DEVICES | Dec 01, 21 | Jun 09, 22 | The Regents of the University of California |
| 2021/0249,524 | TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Apr 28, 21 | Aug 12, 21 | Not available |
| 2021/0082,721 | SUBSTRATE TREATING APPARATUS | Nov 24, 20 | Mar 18, 21 | Not available |
| 2020/0399,756 | PECVD PROCESS | Sep 03, 20 | Dec 24, 20 | Not available |
| 2020/0161,291 | Optical Systems Fabricated by Printing-Based Assembly | Oct 29, 19 | May 21, 20 | Not available |
| 2018/0266,016 | Nitrogen Doped and Vacancy Dominated Silicon Ingot and Thermally Treated Wafer Formed Therefrom Having Radially Uniformly Distributed Oxygen Precipitation Density and Size | May 18, 18 | Sep 20, 18 | Not available |
| 2018/0224,916 | HYBRID COMPUTING MODULE | Dec 18, 17 | Aug 09, 18 | Not available |
| 2018/0012,052 | SYSTEMS AND METHODS FOR SORTING IMAGE ACQUISITION SETTINGS FOR PATTERN STITCHING AND DECODING USING MULTIPLE CAPTURED IMAGES | Mar 20, 17 | Jan 11, 18 | COGNEX CORPORATION |
| 2017/0373,223 | QUANTUM DOT HAVING CORE-SHELL STRUCTURE | Sep 07, 17 | Dec 28, 17 | STANLEY ELECTRIC CO., LTD. |
| 2017/0205,734 | MULTIPASS TRANSFER SURFACE FOR DYNAMIC ASSEMBLY | Jan 18, 16 | Jul 20, 17 | PALO ALTO RESEARCH CENTER INCORPORATED |
| 2015/0280,067 | LIGHT EMITTING ELEMENT ARRAY, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, PRINTING HEAD AND IMAGE FORMING APPARATUS | Mar 30, 15 | Oct 01, 15 | OKI DATA CORPORATION |
| 2015/0011,021 | Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget | Sep 25, 14 | Jan 08, 15 | Not available |
| 2014/0224,418 | METHOD FOR PRODUCING ELECTRONIC COMPONENT | Dec 27, 13 | Aug 14, 14 | MURATA MANUFACTURING CO., LTD. |
| 2014/0197,129 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Jan 02, 14 | Jul 17, 14 | SCREEN HOLDINGS CO., LTD. |
| 2014/0183,610 | Decoupling Capacitor for FinFET Compatible Process | Jan 29, 13 | Jul 03, 14 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |