| 2025/0118,358 | APPARATUSES AND METHODS FOR SINGLE AND MULTI MEMORY CELL ARCHITECTURES | Jun 18, 24 | Apr 10, 25 | Micron Technology Inc. |
| 2025/0098,166 | SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE | Nov 29, 24 | Mar 20, 25 | Kioxia Corporation |
| 2025/0098,170 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Dec 04, 24 | Mar 20, 25 | Not available |
| 2025/0069,630 | SEMICONDUCTOR DEVICE | Dec 19, 23 | Feb 27, 25 | Not available |
| 2025/0063,740 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Oct 24, 24 | Feb 20, 25 | Not available |
| 2025/0037,746 | On-Die Termination of Address and Command Signals | May 31, 24 | Jan 30, 25 | Not available |
| 2025/0037,758 | VERTICAL MEMORY DEVICE WITH A DOUBLE WORD LINE STRUCTURE | Oct 10, 24 | Jan 30, 25 | Not available |
| 2025/0040,148 | MAGNETORESISTIVE RANDOM ACCESS MEMORY | Oct 16, 24 | Jan 30, 25 | United Microelectronics Corp. |
| 2025/0014,615 | MEMORY DEVICE AND SEMICONDUCTOR DEVICE | Jul 10, 24 | Jan 09, 25 | Not available |
| 2024/0429,163 | SEMICONDUCTOR DEVICE | Sep 04, 24 | Dec 26, 24 | Not available |
| 2024/0395,293 | CONTENTION-FREE DUAL-VOLTAGE LOGIC CELL | May 25, 23 | Nov 28, 24 | NVIDIA Corp. |
| 2024/0397,719 | SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME | Aug 01, 24 | Nov 28, 24 | Not available |
| 2024/0386,925 | MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT | Jul 30, 24 | Nov 21, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0379,161 | SEMICONDUCTOR MEMORY DEVICES WITH WRAPPED WORD LINES | Jul 25, 24 | Nov 14, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0373,638 | SEMICONDUCTOR MEMORY DEVICE AND A MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE | Jul 19, 24 | Nov 07, 24 | SK HYNIX INC. |
| 2024/0363,616 | MEMORY ARRAY CIRCUIT AND METHOD OF MANUFACTURING SAME | Jul 10, 24 | Oct 31, 24 | Not available |
| 2024/0341,099 | THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE | Jun 21, 24 | Oct 10, 24 | Not available |
| 2024/0331,740 | USING EMBEDDED SWITCHES FOR REDUCING CAPACITIVE LOADING ON A MEMORY SYSTEM | Mar 12, 24 | Oct 03, 24 | Taiwan Semiconductor Manufacturing Company Limited |
| 2024/0312,830 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD | May 24, 24 | Sep 19, 24 | Not available |
| 2024/0304,265 | Masking Techniques for Memory Applications | Jul 07, 23 | Sep 12, 24 | Not available |