G11C 5/04

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Showing 1 to 20 of 164 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2025/0110,897 TRAINING AND OPERATIONS WITH A DOUBLE BUFFERED MEMORY TOPOLOGYOct 09, 24Apr 03, 25Not available
2025/0094,080 NON-VOLATILE MEMORY MODULE ARCHITECTURE TO SUPPORT MEMORY ERROR CORRECTIONNov 25, 24Mar 20, 25Not available
2025/0098,166 SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURENov 29, 24Mar 20, 25Kioxia Corporation
2025/0087,261 HIGH CAPACITY MEMORY SYSTEM USING STANDARD CONTROLLER COMPONENTOct 02, 24Mar 13, 25Not available
2025/0078,884 BUFFER CONFIGURATIONS FOR COMMUNICATIONS BETWEEN MEMORY DIES AND A HOST DEVICENov 14, 24Mar 06, 25Not available
2025/0068,516 ACCESSING ERROR STATISTICS FROM A CIRCUIT HAVING INTEGRATED ERROR CORRECTIONNov 11, 24Feb 27, 25Not available
2025/0070,094 SEMICONDUCTOR PACKAGENov 14, 24Feb 27, 25Taiwan Semiconductor Manufacturing Company Ltd.
2025/0063,659 EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINSNov 04, 24Feb 20, 25Not available
2025/0054,521 SEMICONDUCTOR DEVICEOct 28, 24Feb 13, 25Kioxia Corporation
2025/0037,746 On-Die Termination of Address and Command SignalsMay 31, 24Jan 30, 25Not available
2025/0028,660 MEMORY MODULE WITH TIMING-CONTROLLED DATA BUFFERINGAug 20, 23Jan 23, 25Not available
2025/0021,235 HIGH-THROUGHPUT LOW-LATENCY HYBRID MEMORY MODULEAug 05, 24Jan 16, 25Not available
2024/0420,793 BUFFER CIRCUIT WITH ADAPTIVE REPAIR CAPABILITYJul 08, 24Dec 19, 24Not available
2024/0402,920 MEMORY MODULE CAPABLE OF REDUCING POWER CONSUMPTION AND SEMICONDUCTOR SYSTEM INCLUDING THE SAMEAug 14, 24Dec 05, 24SK HYNIX INC.
2024/0404,580 MULTI-DIE MEMORY DEVICEMay 07, 24Dec 05, 24Not available
2024/0394,177 MEMORY MODULE WITH DISTRIBUTED DATA BUFFERSMay 27, 24Nov 28, 24Not available
2024/0379,133 SYSTEM AND METHOD FOR PROVIDING COMPRESSION ATTACHED MEMORY MODULE COMPRESSION CONNECTORSJul 17, 24Nov 14, 24Not available
2024/0371,411 CONFIGURABLE MEMORY CARD CONNECTORMay 03, 24Nov 07, 24Amphenol Commercial Products (ChengDu) Co. LTD
2024/0365,556 COMPUTE-IN-MEMORY DEVICE AND METHODJul 11, 24Oct 31, 24Not available
2024/0331,757 INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURESJun 11, 24Oct 03, 24Not available

Showing 1 to 20 of 164 results