| 2025/0114,857 | COPPER ALLOY BONDED BODY | Dec 16, 24 | Apr 10, 25 | NGK INSULATORS, LTD. |
| 2025/0114,858 | COPPER ALLOY JOINED BODY | Dec 16, 24 | Apr 10, 25 | NGK INSULATORS, LTD. |
| 2025/0114,878 | BRAZE ALLOYS | May 16, 24 | Apr 10, 25 | Not available |
| 2025/0109,462 | PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE | Jul 27, 23 | Apr 03, 25 | Mitsubishi Materials Corporation |
| 2025/0109,463 | PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE | Jul 27, 23 | Apr 03, 25 | Mitsubishi Materials Corporation |
| 2025/0109,470 | METHOD OF MANUFACTURING SHEET MATERIAL MADE OF COPPER-SILVER ALLOY AND METHOD OF MANUFATURING SHEET FOR ELECTRODE OF PROBE CARD | Oct 31, 24 | Apr 03, 25 | SWCC Corporation |
| 2025/0083,227 | COPPER ALLOY POWDER FOR LAMINATION SHAPING, LAMINATION SHAPED PRODUCT PRODUCTION METHOD, AND LAMINATION SHAPED PRODUCT | Nov 19, 24 | Mar 13, 25 | JX Nippon Mining & Metals Corporation |
| 2025/0059,636 | COPPER-BERYLLIUM ALLOY WITH HIGH STRENGTH | Nov 07, 24 | Feb 20, 25 | MATERION CORPORATION |
| 2025/0034,679 | COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, AND LEAD FRAME | Oct 12, 22 | Jan 30, 25 | Mitsubishi Materials Corporation |
| 2025/0022,628 | COPPER ALLOY WIRE, COVERED WIRE, COVERED WIRE WITH TERMINAL, AND METHOD FOR MANUFACTURING COPPER ALLOY WIRE | Jun 07, 22 | Jan 16, 25 | SUMITOMO ELECTRIC INDUSTRIES LTD.; AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; |
| 2024/0396,242 | TERMINAL MATERIAL WITH PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL | Aug 31, 22 | Nov 28, 24 | Mitsubishi Materials Corporation |
| 2024/0384,394 | LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME | Jul 26, 24 | Nov 21, 24 | Tosoh SMD, Inc. |
| 2024/0384,395 | LOW CARBON DEFECT COPPER-MANGANESE SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME | Jul 26, 24 | Nov 21, 24 | Tosoh SMD, Inc. |
| 2024/0376,570 | VERY HIGH STRENGTH COPPER-TITANIUM ALLOY WITH IMPROVED FORMABILITY IN THE SOLUTION ANNEALED TEMPER | Aug 16, 22 | Nov 14, 24 | Not available |
| 2024/0336,994 | METAL-ALLOY BIPHASIC SYSTEMS, AND POWDERS AND METHODS FOR MAKING METAL-ALLOY BIPHASIC SYSTEMS | Jun 19, 24 | Oct 10, 24 | Not available |
| 2024/0327,953 | OXIDATION AND CORROSION RESISTANT NANOSTRUCTURED COPPER-BASED METALLIC SYSTEMS | Mar 28, 23 | Oct 03, 24 | Not available |
| 2024/0307,960 | CUTTING TOOL | Dec 20, 21 | Sep 19, 24 | Not available |
| 2024/0279,775 | APPARATUS AND METHOD FOR PRODUCTION OF HIGH PURITY COPPER-BASED ALLOYS | Oct 04, 23 | Aug 22, 24 | Not available |
| 2024/0279,777 | COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY | Apr 25, 24 | Aug 22, 24 | Not available |
| 2024/0271,248 | APPARATUS AND METHOD FOR PRODUCTION OF HIGH PURITY COPPER-BASED ALLOYS | Apr 03, 24 | Aug 15, 24 | Not available |