| 2025/0100,059 | HEAT TREATMENT FURNACE APPARATUS | Dec 09, 24 | Mar 27, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0085,055 | REFLOW OVEN | Jul 26, 22 | Mar 13, 25 | Not available |
| 2025/0087,625 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | Jan 11, 24 | Mar 13, 25 | Not available |
| 2025/0077,904 | METHOD FOR DETERMINING TEMPERATURE OF REFLOW OVEN, ELECTRONIC DEVICE AND STORAGE MEDIUM | Oct 25, 23 | Mar 06, 25 | Not available |
| 2025/0033,131 | SELF CORRECTING OVEN TECHNOLOGY | Dec 07, 22 | Jan 30, 25 | Not available |
| 2025/0033,132 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Jun 20, 24 | Jan 30, 25 | Not available |
| 2024/0426,555 | SYSTEM AND METHOD FOR DETERMINING WHETHER TO CLEAN A REFLOW OVEN | Jun 05, 24 | Dec 26, 24 | Not available |
| 2024/0261,883 | BRAZING METHOD AND BRAZING APPARATUS FOR BRAZING METAL PLATES | Feb 05, 24 | Aug 08, 24 | c/o TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 2024/0173,788 | METHOD AND AUTOMATIC BRAZING APPARATUS FOR FLAME BRAZING CONTROL IN COPPER-ALUMINUM WELDING | Dec 30, 22 | May 30, 24 | Not available |
| 2024/0042,539 | Soldering Apparatus And Method Of Detecting Failures Of Gasket | Oct 17, 23 | Feb 08, 24 | Senju Metal Industry Co. LTD |
| 2024/0009,746 | BRAZING PROBE | Jun 30, 23 | Jan 11, 24 | Not available |
| 2023/0347,437 | SOLDERING DEVICE | Aug 25, 21 | Nov 02, 23 | Senju Metal Industry Co. LTD |
| 2023/0219,156 | BRAZE JOINTS FOR A COMPONENT AND METHODS OF FORMING THE SAME | Mar 21, 23 | Jul 13, 23 | Not available |
| 2023/0117,585 | CONTROL DEVICE FOR PERFORMING BRAZING, BRAZING SYSTEM, AND BRAZING METHOD | Mar 29, 21 | Apr 20, 23 | FANUC Corporation |
| 2022/0320,811 | LASER SOLDERING METHOD AND DEVICE | Sep 26, 19 | Oct 06, 22 | Not available |
| 2021/0402,498 | Soldering Apparatus And Method Of Detecting Failures Of Gasket | May 24, 21 | Dec 30, 21 | Senju Metal Industry Co. LTD |
| 2020/0376,580 | Soldering Device | Nov 27, 17 | Dec 03, 20 | Not available |
| 2020/0267,845 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Dec 27, 19 | Aug 20, 20 | Fuji Electric Co. Ltd. |
| 2020/0180,058 | HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS | Feb 10, 20 | Jun 11, 20 | Pink GmbH Thermosysteme |
| 2019/0262,924 | REFLOW DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE USING THE REFLOW DEVICE | May 09, 19 | Aug 29, 19 | Not available |