| 2025/0118,523 | HIGH VOLTAGE VACUUM TUBES | May 16, 24 | Apr 10, 25 | Not available |
| 2025/0118,704 | APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING | Nov 06, 24 | Apr 10, 25 | Not available |
| 2025/0050,439 | SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME | Oct 29, 24 | Feb 13, 25 | Watlow Electric Manufacturing Company |
| 2025/0018,489 | Brazing Method, Brazed Joint, and Braze | Sep 27, 24 | Jan 16, 25 | ABB Schweiz AG |
| 2024/0416,443 | Method for Producing a Solder Connection and Assembly with a Solder Connection | Oct 04, 22 | Dec 19, 24 | SIEMENS AKTIENGESELLSCHAFT |
| 2024/0408,703 | BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATERIAL COMPOSITION, BONDING FILM, METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODY | Aug 20, 24 | Dec 12, 24 | FURUKAWA ELECTRIC CO., LTD. |
| 2024/0365,475 | REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME | Jul 12, 24 | Oct 31, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0316,667 | ALUMINUM ALLOY BRAZING SHEET AND METHOD FOR MANUFACTURING THE SAME | Aug 09, 22 | Sep 26, 24 | UACJ CORPORATION |
| 2024/0306,262 | Lamp Housing Braze Improvement for Semiconductor Rapid Thermal Processing (RTP) Chamber | Jul 17, 23 | Sep 12, 24 | Not available |
| 2024/0271,874 | HEAT EXCHANGE TUBE | Feb 15, 24 | Aug 15, 24 | Not available |
| 2024/0198,460 | ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY | Apr 14, 22 | Jun 20, 24 | Not available |
| 2024/0173,787 | TOOL AND MANUFACTURING METHOD OF IT | Mar 30, 22 | May 30, 24 | Seco Tools AB |
| 2024/0165,725 | FURNACE BRAZE CYCLE ENHANCEMENT | Nov 22, 22 | May 23, 24 | Not available |
| 2024/0149,339 | COMPOSITE SINTERED BODY, METHOD OF PRODUCING THE SAME, AND JOINING MATERIAL | Mar 07, 22 | May 09, 24 | KAWASAKI JUKOGYO KABUSHIKI KAISHA |
| 2024/0123,531 | LASER BRAZING METHOD | Feb 22, 22 | Apr 18, 24 | JFE Steel Corporation |
| 2024/0107,678 | METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE | Nov 30, 23 | Mar 28, 24 | Not available |
| 2024/0074,065 | REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME | Feb 17, 23 | Feb 29, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0055,707 | METHOD OF FORMING A BRAZED JOINT HAVING MOLYBDENUM MATERIAL | Oct 26, 23 | Feb 15, 24 | Not available |
| 2023/0226,630 | JOINED BODY AND ELECTROSTATIC CHUCK | Jun 11, 21 | Jul 20, 23 | Not available |
| 2023/0182,223 | BRAZING METHOD | Dec 09, 22 | Jun 15, 23 | Not available |