| 2024/0139,847 | BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEOLOGY AND GAS OVERFLOW | Dec 09, 22 | May 02, 24 | CHINA ACADEMY OF MACHINERY NINGBO ACADEMY OF INTELLIGENT MACHINE TOOL CO., LTD.; ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD.; |
| 2023/0278,126 | METHOD AND DEVICE FOR LIQUID SPRAY SOLDERING AND THE APPLICATION METHOD THEREOF | Sep 01, 22 | Sep 07, 23 | Not available |
| 2022/0329,029 | METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS | Feb 18, 22 | Oct 13, 22 | Not available |
| 2022/0219,254 | METHOD OF CONNECTION TO A CONDUCTIVE MATERIAL | Jan 12, 22 | Jul 14, 22 | Carlex Glass America, LLC |
| 2021/0229,203 | ULTRASONIC-ASSISTED SOLDER TRANSFER | Jan 29, 20 | Jul 29, 21 | Not available |
| 2020/0164,452 | METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDER | May 11, 18 | May 28, 20 | Not available |
| 2019/0319,005 | ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME | Jun 27, 19 | Oct 17, 19 | Not available |
| 2018/0240,774 | ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME | Feb 12, 18 | Aug 23, 18 | Not available |
| 2017/0274,464 | METHOD FOR PRODUCING A DISK WITH AN ELECTRICALLY CONDUCTIVE COATING AND A METAL STRIP WHICH IS SOLDERED ONTO THE DISK; AND CORRESPONDING DISK | Aug 19, 15 | Sep 28, 17 | SAINT-GOBAIN GLASS FRANCE |
| 2017/0072,491 | Soldering Device Minimizing Voids When Soldering Printed Circuit Boards | Nov 02, 16 | Mar 16, 17 | Not available |
| 2016/0256,948 | FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION | Oct 21, 14 | Sep 08, 16 | NORTHWESTERN UNIVERSITY |
| 2016/0193,678 | METHOD FOR ULTRASONIC WELDING WITH PARTICLES TRAPPING | Mar 11, 16 | Jul 07, 16 | ABB SCHWEIZ AG |
| 2016/0010,179 | Electroconductive Bonding Material | Aug 30, 13 | Jan 14, 16 | SENJU METAL INDUSTRY CO., LTD. |
| 2015/0129,648 | Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method | Nov 03, 14 | May 14, 15 | ERSA GMBH |
| 2015/0008,249 | Device For Dispensing And Distributing Flux-Free Solder On A Substrate | Jul 03, 14 | Jan 08, 15 | BESI SWITZERLAND AG |
| 2015/0008,252 | MANUFACTURING METHOD FOR A SHIELD CONDUCTOR | Jun 20, 14 | Jan 08, 15 | SUMITOMO WIRING SYSTEMS, LTD. |
| 2014/0252,607 | REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION METHOD, AND SEMICONDUCTOR DEVICE | Oct 26, 12 | Sep 11, 14 | HITACHI CHEMICAL COMPANY, LTD. |
| 2013/0240,605 | WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APPARATUS | Mar 15, 12 | Sep 19, 13 | ASM TECHNOLOGY SINGAPORE PTE LTD |
| 2013/0026,211 | BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING BONDING TOOL | Apr 12, 11 | Jan 31, 13 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| 2012/0298,730 | Method For Dispensing Solder On A Substrate And Method For Mounting Semiconductor Chips | May 17, 12 | Nov 29, 12 | ESEC AG |