| 2025/0022,838 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | Oct 01, 24 | Jan 16, 25 | Not available |
| 2024/0408,701 | WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD | Jul 24, 23 | Dec 12, 24 | BOE MLED TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.; |
| 2024/0321,816 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | Mar 04, 24 | Sep 26, 24 | NCC Nano, LLC |
| 2024/0297,144 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | May 11, 24 | Sep 05, 24 | NCC Nano, LLC |
| 2024/0286,229 | REMOVABLE STOP-OFF MATERIAL FOR BRAZING | Feb 23, 24 | Aug 29, 24 | Not available |
| 2024/0189,932 | SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK DRIVEN BY ARTIFICIAL INTELLIGENCE | Nov 14, 23 | Jun 13, 24 | Not available |
| 2024/0165,726 | Composite Soldering, De-Soldering Station and System | Sep 08, 21 | May 23, 24 | Hakko Corporation |
| 2023/0371,221 | LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY | Jul 19, 23 | Nov 16, 23 | Not available |
| 2023/0249,273 | CONTROL ASSEMBLY FABRICATION VIA BRAZING | Mar 30, 23 | Aug 10, 23 | Not available |
| 2023/0017,361 | SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM | Sep 23, 22 | Jan 19, 23 | HIRATA CORPORATION |
| 2022/0347,779 | HEATING DEVICE | Jul 14, 22 | Nov 03, 22 | Not available |
| 2022/0310,551 | SEMICONDUCTOR MANUFACTURING APPARATUS | Sep 29, 21 | Sep 29, 22 | Not available |
| 2022/0203,471 | PRODUCT REMOVING METHOD, FLUX REMOVING METHOD, AND PRODUCT REMOVING APPARATUS | Dec 06, 21 | Jun 30, 22 | Not available |
| 2022/0105,582 | CONTROL ASSEMBLY FABRICATION VIA BRAZING | Oct 01, 20 | Apr 07, 22 | Not available |
| 2021/0252,621 | SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES | May 04, 21 | Aug 19, 21 | Not available |
| 2021/0114,126 | LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY | Oct 22, 19 | Apr 22, 21 | Not available |
| 2020/0156,168 | Soldering Device, Soldering System And Method | Jul 02, 18 | May 21, 20 | ERSA GMBH |
| 2020/0147,709 | AN APPARATUS FOR AUTOMATICALLY CLEARING RESIDUAL SOLDER PASTE WITH A GAS CHANNEL IN THE WORKING PLATFORM BEARING A SOLDER PASTE TUB | Apr 13, 18 | May 14, 20 | Illinois Tool Works Inc. |
| 2020/0061,730 | HEATING DEVICE | May 25, 18 | Feb 27, 20 | Not available |
| 2019/0247,943 | SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES | Apr 23, 19 | Aug 15, 19 | Not available |