| 2025/0046,750 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Oct 22, 24 | Feb 06, 25 | SAMSUNG ELECTRONICS CO., LTD. |
| 2024/0293,884 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Dec 27, 23 | Sep 05, 24 | Not available |
| 2024/0113,067 | SOLDER REFLOW APPARATUS | Apr 19, 23 | Apr 04, 24 | Not available |
| 2024/0066,618 | METHOD OF USING PROCESSING OVEN | Nov 06, 23 | Feb 29, 24 | Yield Engineering Systems, Inc. |
| 2024/0047,410 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Mar 27, 23 | Feb 08, 24 | Samsung Electronics Co. Ltd. |
| 2024/0047,411 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | Mar 28, 23 | Feb 08, 24 | Samsung Electronics Co. Ltd. |
| 2023/0294,190 | PROCESS CHAMBER WITH UV IRRADIANCE | May 03, 23 | Sep 21, 23 | Yield Engineering Systems, Inc. |
| 2023/0064,858 | DEVICE AND METHOD FOR CONTROLLED HEAT TRANSFER, IN PARTICULAR TO WORKPIECES OF LARGE DIMENSIONS AND MASSES BY MEANS OF A CONDENSING LIQUID | Jan 14, 21 | Mar 02, 23 | Not available |
| 2023/0060,603 | METHOD OF USING PROCESSING OVEN | Jul 25, 22 | Mar 02, 23 | Yield Engineering Systems, Inc. |
| 2022/0258,265 | DEVICE FOR SOLDERING | Jun 05, 20 | Aug 18, 22 | Not available |
| 2021/0205,911 | METHOD OF DIFFUSION BONDING UTILIZING VAPOR DEPOSITION | Jan 06, 20 | Jul 08, 21 | Not available |
| 2021/0046,567 | REFLOW CONDENSATION SOLDERING MACHINE | Aug 05, 20 | Feb 18, 21 | Not available |
| 2019/0314,917 | VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS | Feb 12, 19 | Oct 17, 19 | Not available |
| 2018/0345,397 | VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS | Apr 11, 18 | Dec 06, 18 | Not available |
| 2016/0167,148 | STEAM REFLOW APPARATUS AND STEAM REFLOW METHOD | Dec 11, 15 | Jun 16, 16 | KNE KABUSHIKI KAISHA, SS TECHNO, INC., |
| 2007/0012,746 | Heating type accelerator for soldering paste | Jul 18, 05 | Jan 18, 07 | Not available |