| 2025/0105,203 | SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING SOLDERING APPARATUS | May 21, 24 | Mar 27, 25 | Not available |
| 2025/0069,901 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE | Aug 25, 23 | Feb 27, 25 | Advanced Semiconductor Engineering, Inc. |
| 2025/0033,130 | LASER SOLDERING DEVICE WITH ADJUSTABLE LASER IRRADIATION POSITION AND SOLDERING METHOD COMPRISING SAME | Sep 20, 22 | Jan 30, 25 | LASERVALL TECHNOLOGY CO., LTD |
| 2025/0033,142 | LASER PROCESSING APPARATUS METHOD INCLUDING SAME AND PROCESSED OBJECT PROCESSED THEREBY | Sep 28, 22 | Jan 30, 25 | LASERVALL TECHNOLOGY CO., LTD |
| 2025/0031,480 | TABBING DEVICE FOR MANUFACTURING SOLAR CELL MODULE PREVENTING OVERSOLDERING | Jul 06, 22 | Jan 23, 25 | HANWHA SOLUTIONS CORPORATION |
| 2025/0018,473 | METAL SOLID PRODUCTION METHOD | Sep 27, 24 | Jan 16, 25 | Not available |
| 2025/0001,511 | ELECTRON BEAM BRAZING TO REPAIR COMPONENT | Jun 28, 23 | Jan 02, 25 | Not available |
| 2024/0408,686 | METHOD FOR BRAZE FILLER METAL PREPARATION | Jun 08, 23 | Dec 12, 24 | Not available |
| 2024/0408,687 | SOLDER SOLDERING METHOD USING LASER | Mar 27, 24 | Dec 12, 24 | S.S.P. Inc. |
| 2024/0371,663 | TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRANSFERRING METHOD | Mar 27, 24 | Nov 07, 24 | Not available |
| 2024/0365,475 | REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME | Jul 12, 24 | Oct 31, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0293,893 | SOLDERING APPARATUS AND SOLDERING METHOD USING SAME | Apr 26, 22 | Sep 05, 24 | HCP TECHNOLOGY CO., LTD. |
| 2024/0269,759 | CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMBLY SOLDERING METHOD | Sep 14, 22 | Aug 15, 24 | Honor Device Co., Ltd. |
| 2024/0253,142 | LASER SOLDERING APPARATUS, CONTROL APPARATUS, AND LASER SOLDERING METHOD | Feb 17, 22 | Aug 01, 24 | Not available |
| 2024/0246,162 | RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE | Jan 20, 23 | Jul 25, 24 | Not available |
| 2024/0250,336 | COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLING STRUCTURE | Apr 15, 22 | Jul 25, 24 | 501 Nippon Steel Corporation |
| 2024/0222,302 | REPAIR OF SOLDER BUMPS | Jul 19, 21 | Jul 04, 24 | Not available |
| 2024/0213,209 | METHOD FOR TRANSFERRING ELECTRONIC DEVICE | Mar 05, 24 | Jun 27, 24 | Stroke Precision Advanced Engineering Co., Ltd. |
| 2024/0170,422 | Die-Beam Alignment for Laser-Assisted Bonding | Jan 31, 24 | May 23, 24 | STATS ChipPAC Pte. Ltd. |
| 2024/0157,457 | PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT | Nov 09, 23 | May 16, 24 | Not available |