| 2025/0114,878 | BRAZE ALLOYS | May 16, 24 | Apr 10, 25 | Not available |
| 2025/0112,060 | Robotic Cover Sealer | Apr 01, 24 | Apr 03, 25 | MicroCircuit Laboratories, LLC |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0089,786 | CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM | Dec 05, 24 | Mar 20, 25 | ALTRIA CLIENT SERVICES LLC |
| 2025/0090,669 | PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION | Nov 25, 24 | Mar 20, 25 | Not available |
| 2025/0091,147 | METHODS FOR JOINING COMPONENTS AT NARROW, UNIFORM BRAZE JOINTS | Sep 15, 23 | Mar 20, 25 | Not available |
| 2025/0083,243 | REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AND PREPARATION PROCESS THEREFOR | Nov 21, 24 | Mar 13, 25 | WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD. |
| 2025/0083,244 | METHOD OF BRAZE REPAIR FOR EUTECTIC PHASE REDUCTION | Sep 09, 24 | Mar 13, 25 | Not available |
| 2025/0087,625 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | Jan 11, 24 | Mar 13, 25 | Not available |
| 2025/0073,799 | IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS | Apr 06, 22 | Mar 06, 25 | Safetrack Infrasystems Sisab AB |
| 2025/0073,800 | METHOD FOR REPAIRING WIDE CRACK IN HOT GAS PATH PART FOR GAS TURBINE USING BRAZING | Jul 19, 24 | Mar 06, 25 | Not available |
| 2025/0073,826 | METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, ACTIVE METAL PASTE, CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE | Nov 20, 24 | Mar 06, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0065,429 | MOUNTING SYSTEM AND MEMBER REPLENISHMENT GUIDANCE METHOD | Jan 26, 22 | Feb 27, 25 | FUJI CORPORATION |
| 2025/0069,901 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE | Aug 25, 23 | Feb 27, 25 | Advanced Semiconductor Engineering, Inc. |
| 2025/0071,910 | COMPONENT-ATTACHED FPC MANUFACTURING METHOD | Aug 15, 24 | Feb 27, 25 | Yazaki Corporation |
| 2025/0058,392 | BRAZED HYBRID ALUMINUM/COPPER HEAT EXCHANGERS | Aug 15, 23 | Feb 20, 25 | Not available |
| 2025/0050,439 | SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME | Oct 29, 24 | Feb 13, 25 | Watlow Electric Manufacturing Company |
| 2025/0050,440 | METHOD OF CLEANING A BOTTOM PLATE | Jul 18, 24 | Feb 13, 25 | Not available |
| 2025/0056,735 | Solder Mask Arrangement for a Component Carrier | Oct 31, 24 | Feb 13, 25 | Not available |
| 2025/0041,958 | SELF CORRECTING WAVE SOLDERING MACHINE | Dec 07, 22 | Feb 06, 25 | Not available |