H05K 3/18

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Showing 1 to 20 of 246 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9999125 Method for fabricating ceramic insulator for electronic packagingMay 23, 17Jun 12, 18HE BEI SINOPACK ELECTRONIC TECH CO., LTD.
9992864 Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereonApr 16, 15Jun 05, 18LG Chem Ltd.
9989720 Opto-electric hybrid boardOct 14, 15Jun 05, 18Nitto Denko Corporation
9982348 Method of forming patterned metal unit, and patterned article formed with the sameOct 16, 15May 29, 18Taiwan Green Point Enterprises Co. Ltd.
9986642 Method for manufacturing printed wiring board and printed wiring boardJul 22, 16May 29, 18Ibiden Co. Ltd.
9980371 Printed wiring boardFeb 16, 16May 22, 18IBIDEN CO., LTD.
9980385 Discrete electronic device embedded in chip moduleApr 24, 17May 22, 18International Business Machine Corporation
9980393 Pattern-forming method for forming a conductive circuit patternMay 05, 15May 22, 18Electronics and Telecommunications Research Institute
9974166 Circuit board and manufacturing method thereofSep 13, 16May 15, 18Unimicron Technology Corp.
9974171 Circuit board and method for fabricating the sameNov 17, 15May 15, 18BYD Company Limited
9972898 Antenna structure and method for manufacturing antennaSep 03, 14May 15, 18WISTRON NEWEB CORP.
9967981 Light source unitJan 19, 16May 08, 18Koito Manufacturing Co., Ltd.
9967974 Composition and method for forming conductive pattern, and resin structure having conductive pattern thereonApr 17, 14May 08, 18LG Chem Ltd.
9955579 Printed circuit board having reduced loss of electric signal and method of manufacturing the sameMar 01, 16Apr 24, 18NITTO DENKO CORPORATION
9951434 Printed wiring board, semiconductor package and method for manufacturing printed wiring boardApr 30, 15Apr 24, 18IBIDEN CO., LTD.
9955578 Circuit structureMay 12, 17Apr 24, 18Unimicron Technology Corp.
9944768 High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereofMar 27, 14Apr 17, 18Sabic Global Technologies B.V.
9949374 Electroless plating method and ceramic substrateFeb 04, 14Apr 17, 18MITSUBISHI ELECTRIC CORPORATION
9942981 Circuit board apparatus and methodMay 23, 17Apr 10, 18Sierra Circuits, Inc.
9941054 Integration of embedded thin film capacitors in package substratesJul 19, 16Apr 10, 18Intel Corp.

Showing 1 to 20 of 246 results