B81C 3/00

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9975757 Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devicesJun 03, 15May 22, 18Taiwan Semiconductor Manufacturing Co Ltd.
9980038 Top port multi-part surface mount silicon condenser microphoneMay 26, 17May 22, 18Knowles Electronics, LLC
9956722 Method and device for thermocompression bondingApr 04, 14May 01, 18STRATEC Consumables GmbH
9950922 Packaged microsystemsMar 17, 15Apr 24, 18The Regents of the University of Michigan
9927712 Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing deviceMay 16, 16Mar 27, 18Nikon Corporation
9926188 Sensor unit including a decoupling structure and manufacturing method thereforFeb 05, 15Mar 27, 18502 Robert Bosch GmbH
9919522 MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, and manufacturing method of liquid ejecting headSep 07, 16Mar 20, 18SEIKO EPSON CORPORATION
9911713 Method for applying a bonding layerFeb 24, 17Mar 06, 18EV GROUP E. THALLNER GMBH
9902613 Positioning method in microprocessing process of bulk siliconAug 19, 15Feb 27, 18CSMC TECHNOLOGIES FAB1 CO., LTD.
9891244 Microelectronic packages having split gyroscope structures and methods for the fabrication thereofAug 15, 14Feb 13, 18NXP USA, INC.
9878904 MEMS sensor with electronics integrationOct 25, 16Jan 30, 18Rosemount Aerospace Inc.
9868630 Package structure and manufacturing method thereofAug 16, 16Jan 16, 18TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9862592 MEMS transducer and method for manufacturing the sameMar 13, 15Jan 09, 18TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9842749 Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chipNov 17, 15Dec 12, 17BEIJING UNIVERSITY OF TECHNOLOGY
9835801 Edge construction on optical devicesSep 22, 16Dec 05, 17MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
9782772 Method of bonding two surfaces and construct therefrom and microfluidic device containing the constructNov 02, 15Oct 10, 17SAMSUNG ELECTRONICS CO., LTD.
9764946 MEMs device with outgassing shieldOct 24, 13Sep 19, 17ANALOG DEVICES, INC.
9751752 Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefromNov 30, 16Sep 05, 17INVENSENSE, INC.
9731958 Microelectromechanical system and fabricating process having decoupling structure that includes attaching element for fastening to carrierSep 22, 16Aug 15, 17THALES
9718668 Method of fabricating a nanochannel system for DNA sequencing and nanoparticle characterizationJul 26, 13Aug 01, 17BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS

Showing 1 to 20 of 141 results