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9994441 | Optical electronic device and method of fabrication | Oct 31, 16 | Jun 12, 18 | Agilent Technologies Texas Instruments Incorporated |
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9975757 | Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devices | Jun 03, 15 | May 22, 18 | Taiwan Semiconductor Manufacturing Co Ltd. |
9975762 | Stacked semiconductor structure and method of forming the same | Jun 12, 13 | May 22, 18 | Taiwan Semiconductor Manufacturing Company, Ltd. |
9975758 | Wafer processing equipment having exposable sensing layers | Jul 13, 17 | May 22, 18 | Applied Materials Inc. |
9980052 | MEMS-microphone with reduced parasitic capacitance | Nov 14, 11 | May 22, 18 | 501 TDK Corporation |
9975760 | MEMS sensor device package housing with an embedded controllable device | Jun 28, 16 | May 22, 18 | Robert Bosch GmbH |
9975763 | Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding process | Mar 13, 17 | May 22, 18 | Invensense, Inc. |
9975756 | Micro-electro-mechanical pressure device and methods of forming same | Sep 26, 16 | May 22, 18 | SMI STMicroelectronics S.r.l |
9980038 | Top port multi-part surface mount silicon condenser microphone | May 26, 17 | May 22, 18 | Knowles Electronics, LLC |
9975759 | Method and structure of MEMS PLCSP fabrication | Jul 11, 17 | May 22, 18 | MCube Inc. |
9969610 | Wafer level MEMS package including dual seal ring | Jan 26, 17 | May 15, 18 | Raytheon Company |
9969611 | Structure for controlling flashover in MEMS devices | Dec 01, 17 | May 15, 18 | Eagle Technology, LLC |
9969609 | MEMS device | Oct 18, 16 | May 15, 18 | Semiconductor Manufacturing International ( Shanghai) Corporation |