B29C 33/18

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9937672 Cure tool with integrated edge breather and method of making the sameJan 21, 15Apr 10, 18The Boeing Company
9776358 Molding apparatus and molding methodJun 26, 15Oct 03, 17KYORAKU CO., LTD.
9482441 Composite molded body and method for manufacturing sameMar 18, 13Nov 01, 16TOKAI KOGYO CO., LTD.
9352497 Mould for the rotational moulding of plastic materialsJun 26, 15May 31, 16PERSICO S.P.A.
9308675 Sealing shell and use thereof, device and method for producing foam-molded partsAug 15, 11Apr 12, 16Not available
9050746 IMD mold, injection molding apparatus having such an IMD mold and method for producing a film-decorated plastic partMar 30, 12Jun 09, 15HBW-GUBESCH KUNSTSTOFF-ENGINEERING GMBH
8992207 Cure tool with integrated edge breather and method of making the sameSep 19, 12Mar 31, 15THE BOEING COMPANY
6787093 Semiconductor resin molding methodJun 25, 01Sep 07, 04KABUSHIKI KAISHA TOSHIBA
6773653 In-mold labeling methodOct 05, 01Aug 10, 04CCL LABEL, INC.
6726872 Method for forming plastic molded panels having an undercut edgeApr 08, 94Apr 27, 04INTERNATIONAL AUTOMOTIVE COMPONENTS GROUP NORTH AMERICA, INC.
6511620 Method of producing semiconductor devices having easy separability from a metal mold after moldingFeb 23, 00Jan 28, 03FUJITSU MICROELECTRONICS LIMITED
6444157 Method of resin moldingJun 02, 98Sep 03, 02APIC YAMADA CORPORATION
6280678 Process for producing multilayer molded articleApr 25, 94Aug 28, 01Nissen Chemitec Corporation, SUMITOMO CHEMICAL COMPANY, LIMITED,
6197146 Method and apparatus for forming airfoil structuresDec 21, 98Mar 06, 01SIKORSKY AIRCRAFT CORPORATION
6187235 Method for processing bottle capsAug 31, 98Feb 13, 01ZapatA Technologies, Inc.
6126885 Method for manufacturing resin-molded semiconductor deviceJun 26, 98Oct 03, 00MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
6056530 Device for manufacturing information carriers by injection mouldingApr 24, 98May 02, 00Axxicon Moulds Eindhoven B.V.
5891384 Method of operating a molding machine with release filmNov 21, 95Apr 06, 99APIC YAMADA CORPORATION
5849230 Method of manufacturing a card with a built-in electronic part, formed of a plurality of resin layersFeb 27, 96Dec 15, 98KABUSHIKI KAISHA TOSHIBA
5846477 Production method for encapsulating a semiconductor deviceDec 07, 95Dec 08, 98NITTO DENKO CORPORATION

Showing 1 to 20 of 30 results