B23K 3/053

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
7238919 Heating element movement bonding method for semiconductor componentsFeb 07, 06Jul 03, 07KABUSHIKI KAISHA TOSHIBA
6651867 Robotic turntableMay 24, 02Nov 25, 03PROGRESSIVE TOOL & INDUSTRIES COMPANY
6435397 Robotic turntableMar 21, 01Aug 20, 02COMAU, INC.
5700987 Alignment and bonding techniquesMar 15, 96Dec 23, 97AGERE SYSTEMS OPTOELECTRONICS GUARDIAN CORP., SEOUL SEMICONDUCTOR CO., LTD.,
5054106 Hot gas soldering systemOct 05, 88Oct 01, 91Not available