B23K 1/06

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Showing 1 to 20 of 396 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9975194 Method for ultrasonic welding with particles trappingMar 11, 16May 22, 18ABB Schweiz AG
9889516 Device for dispensing and distributing flux-free solder on a substrateJul 03, 14Feb 13, 18BESI SWITZERLAND AG
9827634 Quality status display for a vibration welding processFeb 15, 17Nov 28, 17GM GLOBAL TECHNOLOGY OPERATIONS LLC
9778531 Contacting of electrochromic devicesJul 23, 14Oct 03, 17CHROMOGENICS AB
9718144 High bandwidth large surface area ultrasonic block hornJun 08, 15Aug 01, 17Branson Ultrasonics Corporation
9711483 Bonding apparatusOct 28, 14Jul 18, 17TORAY ENGINEERING CO., LTD.
9656353 Reflow film, solder bump formation method, solder joint formation method, and semiconductor deviceOct 26, 12May 23, 17HITACHI CHEMICAL COMPANY, LTD.
9607739 Method for bonding flat cable and bonding object, ultrasonic bonding device, and cableJul 20, 15Mar 28, 17YAZAKI CORPORATION
9573221 Elimination of tool adhesion in an ultrasonic welding processJun 15, 15Feb 21, 17GM GLOBAL TECHNOLOGY OPERATIONS LLC
9576929 Multi-strike process for bondingJan 18, 16Feb 21, 17TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9550252 Ultrasonic jointing methodSep 13, 13Jan 24, 17YAZAKI CORPORATION
9545682 Hermetically sealed electronic device using solder bondingNov 04, 15Jan 17, 17FERRO CORPORATION
9505083 Method for producing a node by welding with the same width for two weldsJul 10, 14Nov 29, 16SCHUNK SONOSYSTEMS GMBH
9496670 Ultrasound welding device and method for welding electrical conductorsDec 03, 13Nov 15, 16SCHUNK SONOSYSTEMS GMBH
9487846 Electroconductive bonding materialAug 30, 13Nov 08, 16SENJU METAL INDUSTRY CO., LTD.
9418961 Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnectsAug 08, 13Aug 16, 16TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9385437 Disc comprising an electrical connection elementJul 04, 11Jul 05, 16SAINT-GOBAIN GLASS FRANCE
9358633 Ultrasonic welding deviceApr 03, 14Jun 07, 16SCHUNK SONOSYSTEMS GMBH
9351436 Stud bump bonding in implantable medical devicesMar 08, 13May 24, 16COCHLEAR LIMITED
9339885 Method and apparatus for dispensing flux-free solder on a substrateJun 12, 13May 17, 16BESI SWITZERLAND AG

Showing 1 to 20 of 396 results