B23K 1/015

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
9733134 Solder assembly temperature monitoring processSep 23, 15Aug 15, 17INTERNATIONAL BUSINESS MACHINES CORPORATION
9714870 Solder assembly temperature monitoring processJan 11, 13Jul 25, 17INTERNATIONAL BUSINESS MACHINES CORPORATION
9682438 Steam reflow apparatus and steam reflow methodDec 11, 15Jun 20, 17KNE KABUSHIKI KAISHA, SS TECHNO, INC.,
9243845 Reflow furnaceDec 07, 10Jan 26, 16SENJU METAL INDUSTRY CO., LTD.
9055615 Induction heating cookerNov 30, 09Jun 09, 15PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
8794540 Wire arc spray system using composite wire for porous coating, and related methodJan 12, 10Aug 05, 14GENERAL ELECTRIC COMPANY
8288676 Nut supply apparatus to bonding machineJun 15, 10Oct 16, 12SHINJO HOLDINGS CO., LTD., SHINJO MANUFACTURING CO., LTD.,
5702051 Device for moving an object by means of thermal change in shape or volumeMay 07, 96Dec 30, 97Not available
5542596 Vapor phase soldering machine having a tertiary cooling vaporDec 20, 94Aug 06, 96UNITED TECHNOLOGIES CORPORATION
5333774 Vapor reflow soldering apparatusMar 16, 93Aug 02, 94Hitachi Techno Engineering Co., Ltd.
5188282 Vapor phase flash fusing of printed wiring boardsJan 28, 91Feb 23, 93RAYTHEON COMPANY
5156325 Vapor reflow type soldering method and apparatus thereforDec 20, 90Oct 20, 92Hitachi Techno Engineering Co., Ltd.
5104034 Perfluoro-N,N,N',N-tetrapropyldiaminopropane and use thereof in vapor phase heatingApr 11, 91Apr 14, 92Minnesota Mining and Manufacturing Company
5102028 Localized soldering station using state changing mediumJul 01, 91Apr 07, 92LOCKHEED MARTIN CORPORATION