H01L 21/20

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/20: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials Deposition of semiconductor materials on a substrate, e.g. epitaxial growth

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12261047 Doping techniquesAug 05, 22Mar 25, 25Applied Materials Inc.
12237165 Method for wafer bonding including edge trimmingJul 30, 21Feb 25, 25Taiwan Semiconductor Manufacturing Company Ltd.
12211686 Methods of forming SOI substratesJul 21, 23Jan 28, 25Taiwan Semiconductor Manufacturing Company Ltd.
12199069 Heterogeneous annealing method and deviceDec 28, 22Jan 14, 25ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
12170436 Method for fabricating semiconductor deviceJan 05, 22Dec 17, 24Modulight Oy
12154017 Integrated circuit emulating neural system with neuron circuit and synapse device array and fabrication method thereofFeb 13, 18Nov 26, 24Seoul National University R&DBFoundation; Gachon University of Industry-Academic Corporation Foundation;
12154974 Source/drain formation with reduced selective loss defectsNov 28, 23Nov 26, 24Taiwan Semiconductor Manufacturing Co., Ltd.
12131898 Bonded semiconductor structuresMay 16, 22Oct 29, 24Taiwan Semiconductor Manufacturing Co., Ltd.
12131907 Device and method for bonding of substratesMar 22, 16Oct 29, 24EV GROUP E. THALLNER GMBH
12112952 Methods of forming a semiconductor device including active patterns on a bonding layer and semiconductor devices formed by the sameFeb 23, 22Oct 08, 24Samsung Electronics Co., Ltd.
12105124 System and method for constant transconductance based power supply detectionAug 02, 22Oct 01, 24Taiwan Semiconductor Manufacturing Company Ltd.
12103246 Method of bonding substrates, microchip and method of manufacturing the sameNov 15, 17Oct 01, 24Ushio Denki Kabushiki Kaisha
12107157 High electron mobility transistor and method for fabricating the sameJul 18, 23Oct 01, 24United Microelectronics Corp.
12074247 Nanorod production method and nanorod produced therebySep 19, 22Aug 27, 24Samsung Display Co., Ltd.
12068166 Semiconductor substrateApr 27, 23Aug 20, 24FILNEX INC.
12027428 Semiconductor wafer evaluation method and manufacturing method and semiconductor wafer manufacturing process management methodNov 11, 19Jul 02, 24Sumco Corporation
11948884 Semiconductor device and the manufacturing method thereofAug 24, 21Apr 02, 24Epistar Corporation
11950399 Bonded semiconductor devices having processor and static random-access memory and methods for forming the sameNov 11, 21Apr 02, 24Yangtze Memory Technologies Co., Ltd.
11938563 Annealed workpiece manufacturing method, laser anneal base stage, and laser anneal processing apparatusOct 10, 17Mar 26, 24JSW AKTINA SYSTEM CO., LTD.
11935745 Semiconductor epitaxial wafer and method of producing semiconductor epitaxial wafer, and method of producing solid-state imaging deviceMar 09, 23Mar 19, 24Sumco Corporation

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0118,564 Method for Thinning a Semiconductor SubstrateOct 04, 24Apr 10, 25Not available
2025/0112,047 CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIERSep 29, 23Apr 03, 25Advanced Micro Devices Inc.
2025/0112,086 Methods of Forming One or More Covered Voids in a Semiconductor Substrate, Methods of Forming Field Effect Transistors, Methods of Forming Semiconductor-on-Insulator Substrates, Methods of Forming a Span Comprising Silicon Dioxide, Methods of Cooling Semiconductor Devices, Methods of Forming Electromagnetic Radiation Emitters and Conduits, Methods of Forming Imager Systems, Methods of Forming Nanofluidic Channels, Fluorimetry Methods, and Integrated CircuitryDec 13, 24Apr 03, 25Micron Technology Inc.
2025/0089,405 METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICENov 22, 24Mar 13, 25Silanna UV Technologies Pte Ltd
2025/0054,745 METHOD FOR FABRICATING A DONOR SUBSTRATEDec 23, 22Feb 13, 25Not available
2025/0056,928 METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICEOct 28, 24Feb 13, 25Silanna UV Technologies Pte Ltd
2024/0429,046 METHOD FOR PRODUCING HETEROEPITAXIAL WAFERJun 30, 22Dec 26, 24Shin-Etsu Handotai Co Ltd.
2024/0429,057 METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS ON A BONDING LAYER AND SEMICONDUCTOR DEVICES FORMED BY THE SAMESep 04, 24Dec 26, 24Not available
2024/0412,974 METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAMESep 01, 22Dec 12, 24Not available
2024/0387,702 SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTSJul 30, 24Nov 21, 24Not available
2024/0371,669 CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANSFER BY TRANSFER PRINT AND MANUFACTURING OF THE SEMICONDUCTOR STRUCTURES ON THE CARRIER SUBSTRATEJul 18, 24Nov 07, 24Not available
2024/0371,693 TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIESMay 01, 24Nov 07, 24Not available
2024/0363,345 SILICON CHANNEL FOR BONDED 3D NAND DEVICESFeb 14, 24Oct 31, 24Applied Materials Inc.
2024/0347,340 EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAMEApr 12, 23Oct 17, 24TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.; National Yang Ming Chiao Tung University;
2024/0339,567 METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICEJun 20, 24Oct 10, 24Silanna UV Technologies Pte Ltd
2024/0251,538 BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAMEFeb 26, 24Jul 25, 24Not available
2024/0222,125 SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAMEDec 26, 23Jul 04, 24Resonac Corporation
2024/0222,224 SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATIONDec 29, 22Jul 04, 24Not available
2024/0213,025 DEVICE AND METHOD FOR BONDING OF SUBSTRATESMar 06, 24Jun 27, 24EV GROUP E. THALLNER GMBH
2024/0186,298 DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODSFeb 12, 24Jun 06, 24Not available

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