H01L 21/14

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/14: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials Treatment of the complete device, e.g. by electroforming to form a barrier

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12154793 Etching apparatus and etching methodJul 24, 20Nov 26, 24Tokyo Electron Limited
10763126 Etching apparatus and etching methodApr 24, 19Sep 01, 20Tokyo Electron Limited
10178286 Method for forming color filter array, method for manufacturing imaging apparatus, and imaging apparatusAug 27, 15Jan 08, 19CANON KABUSHIKI KAISHA
9766509 Pixel unitAug 07, 15Sep 19, 17SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
9685371 Method of enabling seamless cobalt gap-fillSep 10, 14Jun 20, 17APPLIED MATERIALS, INC.
9653506 Image sensor and method for fabricating the sameAug 06, 14May 16, 17SK HYNIX INC.
9589911 Integrated circuit structure with metal crack stop and methods of forming sameAug 27, 15Mar 07, 17GLOBALFOUNDRIES INC.
9379064 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the dieApr 28, 15Jun 28, 16STATS CHIPPAC LTD.
9356228 Magnetic tunneling junction devices, memories, memory systems, and electronic devicesFeb 10, 15May 31, 16SAMSUNG ELECTRONICS CO., LTD.
8941239 Copper interconnect structure and method for forming the sameAug 15, 12Jan 27, 15TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8872359 MEMS devicesJun 24, 10Oct 28, 14NXP B.V.
8779509 Semiconductor device including an edge area and method of manufacturing a semiconductor deviceJul 02, 12Jul 15, 14INFINEON TECHNOLOGIES AUSTRIA AG
8772846 Magnetic tunneling junction devices, memories, memory systems, and electronic devicesFeb 16, 12Jul 08, 14SAMSUNG ELECTRONICS CO., LTD.
8698262 Wireless chip and manufacturing method of the sameAug 30, 05Apr 15, 14Semiconductor Energy Laboratory Co., Ltd.
8253211 Semiconductor sensor structures with reduced dislocation defect densitiesSep 24, 09Aug 28, 12TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8101442 Method for manufacturing EL display deviceFeb 20, 09Jan 24, 12Semiconductor Energy Laboratory Co., Ltd.
7911009 NanosensorsSep 30, 09Mar 22, 11PRESIDENT AND FELLOWS OF HARVARD COLLEGE
7790615 Electronic component packagingJul 21, 06Sep 07, 10COMMISSARIAT A L'ENERGIE ATOMIQUE
7768015 Pixel structure of display panel and method of making the sameNov 11, 08Aug 03, 10AU OPTRONICS CORPORATION
7145213 MEMS RF switch integrated processJul 27, 04Dec 05, 06The United States of America as represented by the Secretary of the Air Force

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