H01L 21/12

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/12: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12255065 Semiconductor devices including a support pattern on a lower electrode structureDec 05, 23Mar 18, 25Samsung Electronics Co., Ltd.
12206023 Oxide semiconductor film and semiconductor deviceOct 19, 23Jan 21, 25Semiconductor Energy Laboratory Co. Ltd.
12033901 Device and method used for measuring wafersNov 01, 19Jul 09, 24RAINTREE SCIENTIFIC INSTRUMENTS (SHANGHAI) CORPORATION
11961949 Light emitting device and manufacturing method thereof, backlight module, display panel and display deviceSep 03, 20Apr 16, 24SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
11875992 Semiconductor devices including a support pattern on a lower electrode structureJun 28, 22Jan 16, 24Samsung Electronics Co., Ltd.
11846803 Atomic layer deposition bonding for heterogeneous integration of photonics and electronicsDec 17, 21Dec 19, 23OpenLight Photonics, Inc.
11696510 Diffusion layer for magnetic tunnel junctionsMay 28, 21Jul 04, 23Taiwan Semiconductor Manufacturing Co., Ltd.
11404266 Semiconductor devices including a support pattern on a lower electrode structureApr 21, 20Aug 02, 22Samsung Electronics Co., Ltd.
11237325 Atomic layer deposition bonding for heterogeneous integration of photonics and electronicsApr 09, 20Feb 01, 22Juniper Networks, Inc.
11158724 Method of manufacturing display panelAug 06, 19Oct 26, 21Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
10903249 Array substrate and manufacturing method thereof, display deviceMar 29, 18Jan 26, 21Ordos Yuansheng Optoelectronics Co., Ltd.; BOE Technology Group Co. Ltd.;
10903126 Light irradiation type heat treatment method and heat treatment apparatusApr 15, 20Jan 26, 21SCREEN HOLDING CO., LTD.
10849235 Method of manufacture of a structure and structureMay 20, 20Nov 24, 20TACTOTEK OY
10599043 Critical methodology in vacuum chambers to determine gap and leveling between wafer and hardware componentsAug 11, 17Mar 24, 20APPLIED MATERIALS, INC.
10276374 Methods for forming finsSep 20, 17Apr 30, 19Globalfoundries Inc.
10211227 Display substrate and method of manufacturing the sameJun 23, 17Feb 19, 19Samsung Display Co., Ltd.
10147644 Array substrate, method for manufacturing the same and display deviceSep 29, 16Dec 04, 18BOE Technology Group Co. Ltd.; HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD;
10128305 Semiconductor element having grooves which divide an electrode layer, and method of forming the groovesMay 11, 16Nov 13, 18Siemens Healthcare GmbH
9994743 Adhesive and light-emitting deviceSep 09, 14Jun 12, 18DEXERIALS CORPORATION
9889477 Method and apparatus for enhanced cleaning and inspectionSep 17, 15Feb 13, 18TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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