H01L 21/105

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/105: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination Treatment of the surface of the selenium or tellurium layer after having been made conductive

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11066575 Chemical mechanical planarization for tungsten-containing substratesSep 04, 19Jul 20, 21VERSUM MATERIALS US, LLC
10497575 Method for increasing trench CD in EUV patterning without increasing single line opens or roughnessAug 01, 17Dec 03, 19Tokyo Electron Limited
10128305 Semiconductor element having grooves which divide an electrode layer, and method of forming the groovesMay 11, 16Nov 13, 18Siemens Healthcare GmbH
10002851 Semiconductor packages including chip enablement padsAug 26, 16Jun 19, 18SK hynix Inc.
RE46890 Method of forming semiconductor device having contact pad on source/drain region in peripheral circuit areaDec 08, 15Jun 12, 18Samsung Electronics Co., Ltd.
9299688 Packaged semiconductor devices and methods of packaging semiconductor devicesFeb 18, 14Mar 29, 16TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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