H01L 21/10

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/10: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11393896 Semiconductor device and moduleNov 05, 20Jul 19, 22Murata Manufacturing Co Ltd.
10685875 Semiconductor device having multiple lateral anti-diffusion filmsAug 10, 18Jun 16, 20TOSHIBA MEMORY CORPORATION
10497629 Self-aligned punch through stopper liner for bulk FinFETNov 02, 16Dec 03, 19IBM Corporation
10192907 Array substrate and manufacturing method thereof, display panel and display deviceMar 14, 16Jan 29, 19BOE Technology Group Co. Ltd.
10128305 Semiconductor element having grooves which divide an electrode layer, and method of forming the groovesMay 11, 16Nov 13, 18Siemens Healthcare GmbH
10000862 Method of making quantum dotsMay 21, 14Jun 19, 18SAMSUNG ELECTRONICS CO., LTD.
9922933 Method of positioning elements, particularly optical elements, on the back side of a hybridized-type infrared detectorAug 27, 15Mar 20, 18SOCIETE FRANCAISE DE DETECTEURS INFRAROUGES-SOFRADIR
9520394 Contact structure and extension formation for III-V nFETMay 21, 15Dec 13, 16INTERNATIONAL BUSINESS MACHINES CORPORATION
9431426 Thin film transistor array panel including layered line structure and method for manufacturing the sameAug 17, 15Aug 30, 16SAMSUNG DISPLAY CO., LTD.
9299688 Packaged semiconductor devices and methods of packaging semiconductor devicesFeb 18, 14Mar 29, 16TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9287258 Semiconductor deviceSep 19, 13Mar 15, 16Semiconductor Energy Laboratory Co., Ltd.
9087726 Semiconductor deviceNov 07, 13Jul 21, 15Semiconductor Energy Laboratory Co., Ltd.
9018753 Electronic modulesAug 02, 13Apr 28, 15STMICROELECTRONICS PVT. LTD.
8748214 Method of p-type doping of cadmium tellurideDec 16, 09Jun 10, 14FIRST SOLAR, INC.
8455331 Manufacturing method of semiconductor deviceOct 07, 08Jun 04, 13Semiconductor Energy Laboratory Co., Ltd.
8310038 Integrated circuit packaging system with embedded conductive structure and method of manufacture thereofMar 23, 11Nov 13, 12STATS CHIPPAC PTE. LTE.
7989811 Manufacturing method of semiconductor deviceJan 21, 11Aug 02, 11Semiconductor Energy Laboratory Co., Ltd.
7765682 Apparatus for attaching substratesOct 03, 07Aug 03, 10ADP Engineering Co., Ltd.
7571538 Vacuum fixing jig for semiconductor deviceMar 10, 05Aug 11, 09SOCIONEXT INC.
7550822 Dual-damascene metal wiring patterns for integrated circuit devicesMay 31, 06Jun 23, 09SAMSUNG ELECTRONICS CO., LTD.

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