H01L 21/04

Sub-Class

Watch

Stats

Description

Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/04: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12266530 Manufacturing method of an element of an electronic device having improved reliability, and related element, electronic device and electronic apparatusDec 22, 23Apr 01, 25SMI STMicroelectronics S.r.l
12266531 Method of manufacturing silicon carbide semiconductor deviceFeb 01, 22Apr 01, 25Mitsubishi Electric Corporation
12266852 Electronic deviceJan 02, 24Apr 01, 25Chimei Innolux Corporation
12261046 Semiconductor structures and manufacturing methods thereofApr 04, 24Mar 25, 25DIODES, INCORPORATED
12262550 Semiconductor structure and manufacturing method thereofDec 12, 24Mar 25, 25DIODES, INCORPORATED
12255046 Ion implantation method and ion implanterOct 17, 23Mar 18, 25Sumitomo Heavy Industries Ion Technology Co., Ltd.
12255068 Method for forming an electrical contact and method for forming a semiconductor deviceNov 05, 20Mar 18, 25502 Robert Bosch GmbH
12255227 SiC semiconductor deviceFeb 22, 23Mar 18, 25ROHM CO., LTD.
12255228 Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor deviceFeb 23, 22Mar 18, 25Fuji Electric Co. Ltd.; DENSO Corporation;
12255233 Silicon carbide vertical conduction MOSFET device for power applications and manufacturing process thereofJan 19, 22Mar 18, 25STMicroelectronics S.r.l.
12256559 Source-body self-aligned method of a vertical double diffused metal oxide semiconductor field effect transistorAug 01, 22Mar 18, 25NATIONAL YANG MING CHIAO TUNG UNIVERSITY
12256561 SiC MOSFET device and method for manufacturing the sameNov 30, 21Mar 18, 25Shenzhen Sanrise-Tech Co., LTD
12249630 Method for manufacturing a gridDec 01, 23Mar 11, 25II-VI Delaware, Inc.
12243910 Silicon carbide semiconductor device with overlapping electric field relaxation regions and method of manufacturing the sameApr 12, 22Mar 04, 25DENSO Corporation
12237410 Trench gate silicon carbide MOSFET device and fabrication method thereofNov 05, 24Feb 25, 25JSAB TECHNOLOGIES (SHENZHEN) LTD.
12230675 Planar SiC MOSFET with retrograde implanted channelJul 31, 20Feb 18, 25Hitachi Energy Ltd
12230693 Semiconductor device and manufacturing method thereforAug 18, 20Feb 18, 25CSMC Technologies Fab2 Co., Ltd.
12230704 Semiconductor deviceAug 03, 20Feb 18, 25Fuji Electric Co. Ltd.
12224358 JBS device with improved electrical performances, and manufacturing process of the JBS deviceJan 25, 22Feb 11, 25SMI STMicroelectronics S.r.l
12217964 Doped semiconductor layer forming methodNov 25, 20Feb 04, 25Commissariat à l'énergie atomique et aux énergies alternatives

more results

Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0120,133 GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING DEEP SUPPORT SHIELDS AND METHODS OF FABRICATING SUCH DEVICEOct 06, 23Apr 10, 25Not available
2025/0120,145 TRANSISTOR AND METHOD FOR MANUFACTURING SAMEJun 07, 24Apr 10, 25Microchip Technology Incorporated
2025/0120,147 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEDec 19, 24Apr 10, 25Not available
2025/0113,506 ONE-STEP FRONT OHMIC AND SCHOTTKY CONTACT FORAMTION ON SIC POWER DEVICES WITH LASER ANNEALINGOct 03, 23Apr 03, 25Not available
2025/0113,556 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORApr 16, 24Apr 03, 25ENKRIS SEMICONDUCTOR, INC.
2025/0113,570 MANUFACTURING METHOD AND POWER SEMICONDUCTOR DEVICEJan 30, 23Apr 03, 25Not available
2025/0105,167 METHOD OF PROCESSING WAFERSep 17, 24Mar 27, 25Not available
2025/0107,121 FORMING A SCHOTTKY CONTACT IN AN ELECTRONIC DEVICE, SUCH AS A JBS OR MPS DIODE, AND ELECTRONIC DEVICE WITH SCHOTTKY CONTACTSep 18, 24Mar 27, 25STMicroelectronics International N.V.
2025/0107,146 SEMICONDUCTOR DEVICEDec 09, 24Mar 27, 25ROHM CO., LTD.
2025/0107,165 TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR DEVICESSep 26, 24Mar 27, 25Nexperia B.V.
2025/0107,167 RECESSED REGIONS OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR DEVICESSep 27, 24Mar 27, 25Nexperia B.V.
2025/0107,189 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFFeb 15, 24Mar 27, 25Not available
2025/0095,992 MOSFET DEVICE AND MANUFACTURING METHOD THEREFORMar 22, 23Mar 20, 25Not available
2025/0096,149 SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STRUCTURE AND METHOD OF MANUFACTURINGSep 16, 24Mar 20, 25Not available
2025/0098,236 A POWER SEMICONDUCTOR DEVICE, A POWER CONVERTER INCLUDING THE SAME AND A MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICESep 18, 24Mar 20, 25LX Semicon Co., Ltd.
2025/0089,283 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICEMar 04, 24Mar 13, 25KABUSHIKI KAISHA TOSHIBA
2025/0079,175 Plasma Etched Compound SemiconductorMar 17, 24Mar 06, 25Not available
2025/0068,086 MASKLESS PHOTOLITHOGRAPHY PROCESS FOR THE SYNTHESIS OF METALLIC NANOSTRUCTURES OF FRACTAL GEOMETRY DIRECTLY ON 2D PRINTED CARBON-BASED NANOSHEETS UNDER ROOM TEMPERATURE UV IRRADIATIONAug 23, 24Feb 27, 25Not available
2025/0063,775 SEMICONDUCTOR DEVICE HAVING A SUPERJUNCTION-STRUCTUREAug 05, 24Feb 20, 25Not available
2025/0063,796 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEFeb 06, 24Feb 20, 25Not available

more results

Top Owners in This Subclass

Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More

Patents Issued To Date - By Filing Year

Average Time to Issuance