Class H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass 21/033: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L 21/18 or H01L 21/34 comprising inorganic layers
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12265326 | Method for reducing lithography defects and pattern transfer | Apr 20, 22 | Apr 01, 25 | Tokyo Electron Limited |
| 12266525 | Photomask pellicle including network of nanowires and method of forming the same | Jan 30, 24 | Apr 01, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12266528 | Method for forming patterned mask layer | Jul 05, 23 | Apr 01, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12266529 | Patterning semiconductor devices and structures resulting therefrom | Nov 03, 23 | Apr 01, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 12266531 | Method of manufacturing silicon carbide semiconductor device | Feb 01, 22 | Apr 01, 25 | Mitsubishi Electric Corporation |
| 12266535 | Mask encapsulation to prevent degradation during fabrication of high aspect ratio features | Sep 23, 20 | Apr 01, 25 | Lam Researh Corporation |
| 12266563 | Enlarging contact area and process window for a contact via | Nov 16, 23 | Apr 01, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12266615 | Selective EMI shielding using preformed mask with fang design | Feb 27, 23 | Apr 01, 25 | STATS ChipPAC Pte. Ltd. |
| 12261036 | Forming low-stress silicon nitride layer through hydrogen treatment | Jul 25, 23 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12261044 | Multi-layer hardmask for defect reduction in EUV patterning | Feb 23, 21 | Mar 25, 25 | Lam Research Corporation; International Business Machine Corporation; |
| 12261045 | Patterning method | Jan 03, 22 | Mar 25, 25 | Interuniversitair Microelektronica Centrum (IMEC VZW) |
| 12261057 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Feb 03, 22 | Mar 25, 25 | Tahoe Research, LTD. |
| 12262481 | Electrical devices with electrodes on softening polymers and methods of manufacturing thereof | Jan 02, 24 | Mar 25, 25 | 501 Board of Regents The University of Texas System |
| 12255047 | Embedded high-z marker material and process for alignment of multilevel ebeam lithography | Oct 10, 23 | Mar 18, 25 | HRL Laboratories LLC |
| 12255067 | Method for depositing layers directly adjacent uncovered vias or contact holes | May 23, 22 | Mar 18, 25 | Applied Materials Inc. |
| 12255247 | Trench contact structures for advanced integrated circuit structure fabrication | Jan 18, 24 | Mar 18, 25 | Intel Corp. |
| 12249509 | Selective deposition of carbon on photoresist layer for lithography applications | Jul 31, 23 | Mar 11, 25 | Applied Materials Inc. |
| 12243742 | Method for processing a substrate | Apr 16, 21 | Mar 04, 25 | ASM IP Holding B.V. |
| 12243743 | Method for preparing semiconductor device | Sep 28, 21 | Mar 04, 25 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 12243744 | Method for forming semiconductor structure | Jun 12, 23 | Mar 04, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,539 | METHOD TO IMPROVE WAFER EDGE UNIFORMITY | Oct 16, 24 | Apr 10, 25 | Applied Materials Inc. |
| 2025/0118,557 | SELECTIVE HARDMASK ETCH FOR SEMICONDUCTOR PROCESSING | Oct 05, 23 | Apr 10, 25 | Applied Materials Inc. |
| 2025/0118,558 | MASK PATTERN AND METHOD OF FORMING A FINE PATTERN OF A SEMICONDUCTOR DEVICE USING THE SAME | Apr 30, 24 | Apr 10, 25 | Not available |
| 2025/0118,559 | MANDREL STRUCTURES AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES | Dec 17, 24 | Apr 10, 25 | Not available |
| 2025/0118,560 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | Nov 16, 23 | Apr 10, 25 | United Semiconductor (Xiamen) Co., Ltd. |
| 2025/0118,570 | BOW MITIGATION IN HIGH ASPECT RATIO OXIDE AND NITRIDE ETCHES | Oct 06, 23 | Apr 10, 25 | Applied Materials Inc. |
| 2025/0112,046 | BORON CONCENTRATION TUNABILITY IN BORON-SILICON FILMS | Dec 13, 24 | Apr 03, 25 | Applied Materials Inc. |
| 2025/0110,411 | METHOD FOR FORMING A PATTERN ON A SUBSTRATE | Sep 27, 24 | Apr 03, 25 | Not available |
| 2025/0102,922 | Exposure method of semiconductor pattern | Oct 22, 23 | Mar 27, 25 | United Microelectronics Corp. |
| 2025/0105,015 | METHODS AND STRUCTURES FOR IMPROVING ETCH PROFILE OF UNDERLYING LAYERS | Sep 26, 23 | Mar 27, 25 | Tokyo Electron Limited |
| 2025/0095,989 | Composition For Forming Organic Film, Method For Forming Organic Film, And Patterning Process | Sep 05, 24 | Mar 20, 25 | Shin-Etsu Chemical Co. Ltd. |
| 2025/0095,990 | METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-CONTAINING PRECURSORS | Aug 28, 24 | Mar 20, 25 | Applied Materials Inc. |
| 2025/0095,991 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Dec 03, 24 | Mar 20, 25 | Tokyo Electron Limited |
| 2025/0096,007 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD | Sep 12, 24 | Mar 20, 25 | SEMES CO., LTD. |
| 2025/0096,033 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Sep 16, 23 | Mar 20, 25 | Not available |
| 2025/0098,258 | PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Dec 05, 24 | Mar 20, 25 | Not available |
| 2025/0085,637 | EXPOSURE MASK, SEMICONDUCTOR DEVICE USING THE EXPOSURE MASK, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Feb 26, 24 | Mar 13, 25 | SK HYNIX INC. |
| 2025/0087,487 | FORMATION OF AN ARRAY OF NANOSTRUCTURES | Nov 22, 24 | Mar 13, 25 | Not available |
| 2025/0087,488 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0087,496 | METHODS FOR FABRICATING SEMICONDCUTOR STRUCTURES | Nov 26, 24 | Mar 13, 25 | Not available |
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