Class H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass 21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12266508 | Plasma processing apparatus and method for venting a processing chamber to atmosphere | Nov 20, 20 | Apr 01, 25 | HITACHI HIGH-TECH CORPORATION |
| 12266531 | Method of manufacturing silicon carbide semiconductor device | Feb 01, 22 | Apr 01, 25 | Mitsubishi Electric Corporation |
| 12266557 | Wafer placement table | Jul 29, 22 | Apr 01, 25 | NGK Insulators Ltd. |
| 12266622 | Method of manufacturing semiconductor structure having hybrid bonding pad | Jun 14, 22 | Apr 01, 25 | NANYA TECHNOLOGY CORPORATION |
| 12268042 | Variable resistance memory device | May 17, 22 | Apr 01, 25 | Samsung Electronics Co. Ltd. |
| 12268053 | Method of manufacturing display device | Mar 30, 20 | Apr 01, 25 | Samsung Display Co., Ltd. |
| 12261040 | Substrate stripping method and epitaxial wafer | Oct 30, 20 | Mar 25, 25 | HC Semitek (Zhejiang) Co. Ltd. |
| 12261079 | Method for fabricating a strained semiconductor-on-insulator substrate | Aug 14, 23 | Mar 25, 25 | Soitec |
| 12261149 | Manufacturing method of semiconductor structure | Jul 27, 22 | Mar 25, 25 | Powerchip Semiconductor Manufacturing Corporation |
| 12261198 | Semiconductor device and method for fabricating the same | Jan 08, 24 | Mar 25, 25 | SK Hynix Inc. |
| 12261226 | Transistor devices with multi-layer interlayer dielectric structures | Mar 10, 22 | Mar 25, 25 | Applied Materials Inc. |
| 12261259 | Light-emitting chip and light-emitting substrate | Sep 22, 21 | Mar 25, 25 | BOE MLED TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.; |
| 12262525 | Semiconductor structure preparation method, semiconductor structure and semiconductor memory | Feb 10, 22 | Mar 25, 25 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 12262542 | Ferroelectric memory device | Jul 23, 23 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12262543 | High density ferroelectric random access memory (FeRAM) devices and methods of fabrication | Aug 16, 23 | Mar 25, 25 | Kepler Computing Inc. |
| 12255049 | Plasma processing apparatus and plasma processing method | Nov 05, 19 | Mar 18, 25 | Tokyo Electron Limited |
| 12255062 | Integrate rinse module in hybrid bonding platform | Nov 14, 23 | Mar 18, 25 | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 12255067 | Method for depositing layers directly adjacent uncovered vias or contact holes | May 23, 22 | Mar 18, 25 | Applied Materials Inc. |
| 12255078 | Semiconductor devices and methods of manufacturing | Aug 10, 23 | Mar 18, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 12255193 | Method for transferring micro LED | Jun 05, 20 | Mar 18, 25 | Industry-University Cooperation Foundation Hanyang University ERICA Campus |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0102,887 | DEVICE WITH A RECESSED GATE ELECTRODE THAT HAS HIGH THICKNESS UNIFORMITY | Dec 09, 24 | Mar 27, 25 | Not available |
| 2024/0416,514 | CALIBRATION SYSTEM | Aug 29, 24 | Dec 19, 24 | Not available |
| 2024/0069,412 | IMAGE PICKUP DEVICE AND METHOD OF TRACKING SUBJECT THEREOF | Nov 08, 23 | Feb 29, 24 | Not available |
| 2024/0047,604 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME | Oct 17, 23 | Feb 08, 24 | Not available |
| 2022/0181,513 | HYBRID GROWTH METHOD FOR III-NITRIDE TUNNEL JUNCTION DEVICES | Dec 01, 21 | Jun 09, 22 | The Regents of the University of California |
| 2020/0399,756 | PECVD PROCESS | Sep 03, 20 | Dec 24, 20 | Not available |
| 2018/0224,916 | HYBRID COMPUTING MODULE | Dec 18, 17 | Aug 09, 18 | Not available |
| 2018/0012,052 | SYSTEMS AND METHODS FOR SORTING IMAGE ACQUISITION SETTINGS FOR PATTERN STITCHING AND DECODING USING MULTIPLE CAPTURED IMAGES | Mar 20, 17 | Jan 11, 18 | COGNEX CORPORATION |
| 2011/0079,273 | PHOTOVOLTAIC DEVICES | Jan 09, 09 | Apr 07, 11 | MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
| 2007/0020,793 | Three-dimensional shaped solid dosimeter and method of use | Aug 21, 06 | Jan 25, 07 | Not available |
| 2006/0292,722 | FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME | Aug 30, 06 | Dec 28, 06 | Not available |
| 2004/0101,979 | Ferroelectric resistor non-volatile memory | Nov 26, 02 | May 27, 04 | SHARP LABORATORIES OF AMERICA, INC. |
| 2004/0053,431 | Method of forming a flexible thin film transistor display device with a metal foil substrate | Jun 11, 03 | Mar 18, 04 | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 2003/0203,511 | Method of manufacture of ferroelectric memory | Dec 02, 02 | Oct 30, 03 | OKI ELECTRIC INDUSTRY CO., LTD. |
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