Description
Class G11C : STATIC STORES
Subclass 5/10: Details of stores covered by group G11C 11/00 Arrangements for interconnecting storage elements electrically, e.g. by wiring for interconnecting capacitors
G11C 5/10
Sub-Class
Stats
- 109 US PATENTS IN FORCE
- 24 US APPLICATIONS PENDING
- 22 Total Patent Owners
- 235 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12243583 | Semiconductor device electronic device | Jul 06, 21 | Mar 04, 25 | SEMICONDUCTOR ENERGY LABORATORY CO., LTD |
| 12230988 | Constant current charging capacitor test | Jul 23, 21 | Feb 18, 25 | Intel Corp. |
| 12225711 | Semiconductor device comprising wiring layer over driver circuit | Oct 23, 23 | Feb 11, 25 | Semiconductor Energy Laboratory Co. Ltd. |
| 12136465 | Semiconductor device and electronic device | May 06, 21 | Nov 05, 24 | Semiconductor Energy Laboratory Co. Ltd. |
| 12137549 | Microelectronic devices comprising capacitor structures, and related electronic systems and methods | Aug 30, 21 | Nov 05, 24 | Micron Technology Inc. |
| 12133372 | Pumping capacitor and semiconductor memory device including the same | Mar 01, 22 | Oct 29, 24 | Samsung Electronics Co. Ltd. |
| 12101941 | Ferroelectric memory structure | Nov 30, 21 | Sep 24, 24 | Powerchip Semiconductor Manufacturing Corporation |
| 12096615 | Semiconductor devices having contact plugs | Sep 15, 23 | Sep 17, 24 | SAMSUNG ELECTRONICS CO., LTD. |
| 12089392 | Method for manufacturing semiconductor structure | Dec 02, 21 | Sep 10, 24 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 12082399 | Memory devices having vertical transistors in staggered layouts | Dec 01, 21 | Sep 03, 24 | Yangtze Memory Technologies Co., Ltd. |
| 12040042 | Semiconductor device including transistor | Jan 25, 23 | Jul 16, 24 | Semiconductor Energy Laboratory Co. Ltd. |
| 11929324 | Semiconductor devices having improved electrical characteristics and methods of fabricating the same | Apr 12, 23 | Mar 12, 24 | Samsung Electronics Co., Ltd. |
| 11915777 | Integrated assemblies and methods forming integrated assemblies | Feb 10, 22 | Feb 27, 24 | Micron Technology Inc. |
| 11917808 | Semiconductor device and method of forming the same | Sep 24, 21 | Feb 27, 24 | Micron Technology Inc. |
| 11910593 | Ground-connected supports with insulating spacers for semiconductor memory capacitors and method of fabricating the same | Sep 25, 20 | Feb 20, 24 | Samsung Electronics Co. Ltd. |
| 11903183 | Conductive line contact regions having multiple multi-direction conductive lines and staircase conductive line contact structures for semiconductor devices | Oct 01, 20 | Feb 13, 24 | Micron Technology Inc. |
| 11869578 | Memory bank and memory | Sep 13, 21 | Jan 09, 24 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 11841796 | Scratchpad memory in a cache | Jan 05, 22 | Dec 12, 23 | Micron Technology Inc. |
| 11810608 | Manganese or scandium doped multi-element non-linear polar material gain memory bit-cell | Dec 02, 22 | Nov 07, 23 | Kepler Computing Inc. |
| 11805637 | Semiconductor device comprising first and second conductors | Aug 16, 21 | Oct 31, 23 | Semiconductor Energy Laboratory Co. Ltd. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0063,719 | MEMORY DEVICES INCLUDING CAPACITORS | Nov 01, 24 | Feb 20, 25 | Not available |
| 2025/0054,523 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Oct 31, 24 | Feb 13, 25 | Not available |
| 2025/0014,615 | MEMORY DEVICE AND SEMICONDUCTOR DEVICE | Jul 10, 24 | Jan 09, 25 | Not available |
| 2024/0321,323 | MEMORY DEVICE | Feb 27, 24 | Sep 26, 24 | Not available |
| 2024/0284,660 | SPLIT PILLAR AND PIER MEMORY ARCHITECTURES | Feb 14, 24 | Aug 22, 24 | Not available |
| 2024/0257,855 | MEMORY CELL SENSING ARCHITECTURE | Jan 03, 24 | Aug 01, 24 | Not available |
| 2024/0153,541 | Integrated Assemblies and Methods Forming Integrated Assemblies | Jan 16, 24 | May 09, 24 | Micron Technology Inc. |
| 2024/0147,693 | CONDUCTIVE LINE CONTACT REGIONS HAVING MULTIPLE MULTI-DIRECTION CONDUCTIVE LINES AND STAIRCASE CONDUCTIVE LINE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES | Jan 04, 24 | May 02, 24 | Not available |
| 2024/0130,111 | GROUND-CONNECTED SUPPORTS WITH INSULARING SPACERS FOR SEMICONDUCTORMEMORY CAPACTITORS AND METHOD OF FABRICATING THE SAME | Dec 26, 23 | Apr 18, 24 | Samsung Electronics Co., Ltd. |
| 2024/0098,965 | HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY | Sep 20, 22 | Mar 21, 24 | Intel Corp. |
| 2024/0087,616 | SEMICONDUCTOR MEMORY DEVICE | Sep 08, 23 | Mar 14, 24 | Kioxia Corporation |
| 2024/0038,280 | SEMICONDUCTOR MEMORY DEVICE | Mar 16, 23 | Feb 01, 24 | Kioxia Corporation |
| 2024/0013,829 | SEMICONDUCTOR DEVICE | Nov 09, 21 | Jan 11, 24 | Not available |
| 2023/0413,519 | SEMICONDUCTOR MEMORY DEVICE | Mar 07, 23 | Dec 21, 23 | Kioxia Corporation |
| 2022/0358,971 | Integrated Assemblies and Methods Forming Integrated Assemblies | Feb 10, 22 | Nov 10, 22 | Micron Technology Inc. |
| 2022/0310,616 | MEMORY CELL AND MEMORY DEVICE | Aug 11, 20 | Sep 29, 22 | Not available |
| 2022/0310,614 | Semiconductor Structure and Method for Manufacturing Semiconductor Structure | Jan 13, 22 | Sep 29, 22 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 2022/0285,362 | METHODS AND STRUCTURES FOR THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY | Feb 17, 22 | Sep 08, 22 | Not available |
| 2020/0105,311 | Integrated Assemblies Which Include Non-Conductive-Semiconductor-Material and Conductive-Semiconductor-Material, and Methods of Forming Integrated Assemblies | Dec 04, 19 | Apr 02, 20 | Micron Technology Inc. |
| 2020/0027,486 | Integrated Assemblies Which Include Non-Conductive-Semiconductor-Material and Conductive-Semiconductor-Material, and Methods of Forming Integrated Assemblies | Jul 19, 18 | Jan 23, 20 | Micron Technology, Inc. |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 16 Months (last 2 years Issuances)
- 16 Months (last 5 years Issuances)