Description
Class G11C : STATIC STORES
Subclass 5/02: Details of stores covered by group G11C 11/00 Disposition of storage elements, e.g. in the form of a matrix array
G11C 5/02
Sub-Class
Stats
- 2,263 US PATENTS IN FORCE
- 128 US APPLICATIONS PENDING
- 176 Total Patent Owners
- 3,721 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12265489 | Communicating data with stacked memory dies | Sep 18, 23 | Apr 01, 25 | Not available |
| 12254918 | Write driver boost circuit for memory cells | Jan 02, 24 | Mar 18, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12254919 | Sub-word line driver placement for memory device | Feb 16, 24 | Mar 18, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12254946 | Multi-deck non-volatile memory architecture with reduced termination tile area | Sep 23, 21 | Mar 18, 25 | Intel Corp. |
| 12249377 | Apparatuses and methods for organizing data in a memory device | Jul 24, 23 | Mar 11, 25 | Not available |
| 12249390 | Memory systems with vertical integration | May 12, 23 | Mar 11, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12249399 | On-die termination of address and command signals | May 31, 24 | Mar 11, 25 | RAMBUS INC. |
| 12249598 | Integrated assemblies comprising vertically-stacked decks with interconnected conductive lines | Jul 11, 22 | Mar 11, 25 | Micron Technology Inc. |
| 12250812 | Integrated assemblies and methods of forming integrated assemblies | Jan 09, 23 | Mar 11, 25 | Micron Technology Inc. |
| 12243575 | Memory system having combined high density, low bandwidth and low density, high bandwidth memories | Nov 21, 23 | Mar 04, 25 | Apple Inc. |
| 12236141 | Memory circuit and memory | Jul 06, 22 | Feb 25, 25 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 12237040 | Method and apparatus to perform a read of a column in a memory accessible by row and/or by column | Sep 07, 21 | Feb 25, 25 | Intel Corp. |
| 12230314 | Semiconductor device, memory device, and electronic device | Apr 18, 23 | Feb 18, 25 | Semiconductor Energy Laboratory Co. Ltd. |
| 12230326 | Semiconductor memory device with conductive layers separated between memory blocks | Sep 13, 22 | Feb 18, 25 | Kioxia Corporation |
| 12223989 | Semiconductor device and method for fabricating the same | Jan 09, 23 | Feb 11, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 12224275 | TSV check circuit with replica path | Sep 29, 21 | Feb 11, 25 | Micron Technology Inc. |
| 12217825 | Drive circuit and memory device | Mar 07, 23 | Feb 04, 25 | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 12219758 | Integrated assemblies having transistor body regions coupled to carrier-sink-structures; and methods of forming integrated assemblies | Jan 31, 24 | Feb 04, 25 | Micron Technology Inc. |
| 12211583 | Data-buffer controller/control-signal redriver | Aug 24, 21 | Jan 28, 25 | RAMBUS INC. |
| 12211825 | Memory array, integrated circuit including the same, and manufacturing method thereof | Aug 30, 21 | Jan 28, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,341 | STRUCTURES FOR WORD LINE MULTIPLEXING IN THREE-DIMENSIONAL MEMORY ARRAYS | Oct 17, 24 | Apr 10, 25 | Not available |
| 2025/0110,897 | TRAINING AND OPERATIONS WITH A DOUBLE BUFFERED MEMORY TOPOLOGY | Oct 09, 24 | Apr 03, 25 | Not available |
| 2025/0095,708 | APPARATUSES AND METHODS FOR OPERATIONS IN A SELF-REFRESH STATE | Nov 26, 24 | Mar 20, 25 | Not available |
| 2025/0098,158 | MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES AND ADDITIONAL SLOT STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Dec 03, 24 | Mar 20, 25 | Not available |
| 2025/0098,159 | MEMORY DEVICES INCLUDING PAD STRUCTURES | Dec 05, 24 | Mar 20, 25 | Not available |
| 2025/0098,166 | SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE | Nov 29, 24 | Mar 20, 25 | Kioxia Corporation |
| 2025/0087,249 | INTERCONNECTIONS FOR 3D MEMORY | Aug 21, 24 | Mar 13, 25 | Not available |
| 2025/0087,252 | MEMORY BANDWIDTH AGGREGATION USING SIMULTANEOUS ACCESS OF STACKED SEMICONDUCTOR MEMORY DIE | Oct 17, 24 | Mar 13, 25 | Not available |
| 2025/0087,270 | THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY | Nov 20, 24 | Mar 13, 25 | Kioxia Corporation |
| 2025/0081,425 | MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Nov 18, 24 | Mar 06, 25 | Not available |
| 2025/0063,719 | MEMORY DEVICES INCLUDING CAPACITORS | Nov 01, 24 | Feb 20, 25 | Not available |
| 2025/0054,521 | SEMICONDUCTOR DEVICE | Oct 28, 24 | Feb 13, 25 | Kioxia Corporation |
| 2025/0046,358 | Memory Arrays Comprising Vertically-Alternating Tiers of Insulative Material and Memory Cells and Methods of Forming a Memory Array | Oct 21, 24 | Feb 06, 25 | Micron Technology Inc. |
| 2025/0038,045 | ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDING THE SAME | Aug 06, 24 | Jan 30, 25 | Not available |
| 2025/0031,364 | SEMICONDUCTOR DEVICES INCLUDING STACK STRUCTURE HAVING GATE REGION AND INSULATING REGION | Oct 04, 24 | Jan 23, 25 | Not available |
| 2025/0022,490 | CONVOLUTION OPERATION ACCELERATOR AND CONVOLUTION OPERATION METHOD | Apr 20, 22 | Jan 16, 25 | Huazhong University of Science and Technology |
| 2024/0420,738 | MEMORY DEVICE HAVING SUPPORT STRUCTURE | Nov 08, 23 | Dec 19, 24 | SK HYNIX INC. |
| 2024/0422,967 | MEMORY DEVICES AND RELATED METHODS | Aug 28, 24 | Dec 19, 24 | Not available |
| 2024/0414,912 | SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Aug 23, 24 | Dec 12, 24 | Not available |
| 2024/0404,580 | MULTI-DIE MEMORY DEVICE | May 07, 24 | Dec 05, 24 | Not available |
Top Owners in This Subclass
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Patents Issued To Date - By Filing Year
Average Time to Issuance
- 21 Months (last 2 years Issuances)
- 21 Months (last 5 years Issuances)